PACKAGE STRUCTURE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Chao-Wei Li of Hsinchu City TW

Chun-Yen Lan of Hsinchu County TW

Yu-Wei Lin of New Taipei City TW

Sheng-Hsiang Chiu of Tainan City TW

Tzu-Ting Chou of Hsinchu City TW

Pei-Hsuan Lee of Tainan City TW

Chih-Wei Lin of Hsinchu County TW

Ching-Hua Hsieh of Hsinchu TW

PACKAGE STRUCTURE

This abstract first appeared for US patent application 18499230 titled 'PACKAGE STRUCTURE

Original Abstract Submitted

A package structure is provided. The package structure comprises a package substrate, an electronic device, a thermal interface material (TIM), a lid and an insulating encapsulant. The electronic device is disposed on and electrically connected to the package substrate. The TIM is disposed on the electronic device. The lid is disposed on the TIM. The insulating encapsulant is disposed on the package substrate and laterally encapsulates the electronic device and the TIM. A lateral dimension of the TIM is greater than a lateral dimension of the electronic device.