Realtek Semiconductor Corp. Patent Application Trends in 2025
Realtek Semiconductor Corp. Patent Filing Activity
Realtek Semiconductor Corp. patent applications in 2025
Top 10 Technology Areas
- H04B2001/0425 (TRANSMISSION)
- H01L2924/3011 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 3 patents
- Example: 20250069995. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (REALTEK SEMICONDUCTOR CORP.)
- H04B1/0475 ({with means for limiting noise, interference or distortion ()
- H01L23/49541 (Lead-frames {or other flat leads ()
- Count: 2 patents
- Example: 20250069995. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (REALTEK SEMICONDUCTOR CORP.)
- H01L23/49575 (Lead-frames {or other flat leads ()
- Count: 2 patents
- Example: 20250069995. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (REALTEK SEMICONDUCTOR CORP.)
- H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 2 patents
- Example: 20250069995. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (REALTEK SEMICONDUCTOR CORP.)
- H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 2 patents
- Example: 20250069995. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (REALTEK SEMICONDUCTOR CORP.)
- H01L24/81 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 2 patents
- Example: 20250069995. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (REALTEK SEMICONDUCTOR CORP.)
- H01L2224/81815 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 2 patents
- Example: 20250069995. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (REALTEK SEMICONDUCTOR CORP.)
- G06T3/60 (Rotation of whole images or parts thereof)
Emerging Technology Areas
- G06F9/485 (Program initiating; Program switching, e.g. by interrupt)
- G06F9/4881 (Program initiating; Program switching, e.g. by interrupt)
- H04W76/11 (Allocation or use of connection identifiers)
- Count: 1 patents
- Example: 20250103318. DONGLE DEVICE AND FIRMWARE UPDATING METHOD THEREOF (REALTEK SEMICONDUCTOR CORP.)
- H04L67/34 ({involving the movement of software or configuration parameters (network booting or remote initial program loading [RIPL])
- Count: 1 patents
- Example: 20250103318. DONGLE DEVICE AND FIRMWARE UPDATING METHOD THEREOF (REALTEK SEMICONDUCTOR CORP.)
- G06F8/65 (Updates (security arrangements therefor)
- Count: 1 patents
- Example: 20250103318. DONGLE DEVICE AND FIRMWARE UPDATING METHOD THEREOF (REALTEK SEMICONDUCTOR CORP.)
- H10N10/82 (No explanation available)
- Count: 1 patents
- Example: 20250017110. THERMOELECTRIC COOLING CHIP AND PACKAGE STRUCTURE THEREOF (Realtek Semiconductor Corp.)
- H01L23/42 (Fillings or auxiliary members in containers {or encapsulations} selected or arranged to facilitate heating or cooling)
- Count: 1 patents
- Example: 20250017110. THERMOELECTRIC COOLING CHIP AND PACKAGE STRUCTURE THEREOF (Realtek Semiconductor Corp.)
- H01L23/38 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20250017110. THERMOELECTRIC COOLING CHIP AND PACKAGE STRUCTURE THEREOF (Realtek Semiconductor Corp.)
- H10N10/17 (No explanation available)
- Count: 1 patents
- Example: 20250017110. THERMOELECTRIC COOLING CHIP AND PACKAGE STRUCTURE THEREOF (Realtek Semiconductor Corp.)
- H04L25/03057 ({with a recursive structure ()
Top Inventors
- Chia-Liang (Leon) Lin of Fremont CA (US) (3 patents)
- Yuan-Shuo Chang (2 patents)
- Nai-Jen Hsuan (2 patents)
- Ping-Hsuan Tsai (2 patents)
- Chia-Jun Chang (2 patents)
- Yu-Cheng Lo (1 patent)
- Shu-Yu Chang (1 patent)
- Chao-Min Lai (1 patent)
- HSIN-CHIA CHUNG (1 patent)
- Kuan-Yu Shih (1 patent)
Patent Categories
Geographical Distribution of Inventors
Geographical Distribution of US Inventors
Categories:
- Realtek Semiconductor Corp.
- Companies
- CPC H03K17/005
- CPC H03K19/00346
- CPC H03K19/017545
- CPC H04B1/0475
- CPC H04B2001/0425
- CPC G06F1/08
- CPC G06F1/10
- CPC H01L23/49531
- CPC H01L21/4825
- CPC H01L21/565
- CPC H01L23/3107
- CPC H01L23/49541
- CPC H01L23/49575
- CPC H01L23/552
- CPC H01L24/16
- CPC H01L24/48
- CPC H01L24/81
- CPC H01L24/85
- CPC H01L2224/16245
- CPC H01L2224/48225
- CPC H01L2224/48245
- CPC H01L2224/81815
- CPC H01L2924/3011
- CPC H01L2924/3025
- CPC H03K3/017
- CPC H03K3/356113
- CPC H03B5/1212
- CPC H03B2200/009
- CPC G06F13/20
- CPC H04N21/43635
- CPC G06F2213/40
- CPC G06F21/44
- CPC H04B1/0057
- CPC H04B1/109
- CPC H04W88/06
- CPC H04W72/1268
- CPC H04L5/0053
- CPC H04W24/02
- CPC H04W80/02
- CPC G01R31/2884
- CPC G06V10/44
- CPC G06T3/60
- CPC G06T7/62
- CPC G06T2207/20084
- CPC G06T2207/30201
- CPC H04B1/005
- CPC H04B1/04
- CPC H04W52/0238
- CPC H04W52/0216
- CPC H04W52/0229
- CPC H04W12/037
- CPC H03K5/00
- CPC H03K2005/00019
- CPC H03K2005/00241
- CPC H01L21/4821
- CPC H01L23/49548
- CPC H01L23/49558
- CPC H01L23/49589
- CPC H01L24/11
- CPC H01L24/17
- CPC H01L23/49568
- CPC H01L2224/113
- CPC H01L2224/11849
- CPC H01L2224/1601
- CPC H01L2224/16258
- CPC H01L2224/1703
- CPC G06F3/0625
- CPC G06F3/0634
- CPC G06F3/0673
- CPC G06F30/33
- CPC G06F30/34
- CPC H04L25/03866
- CPC G06V10/764
- CPC G06T7/11
- CPC H01L23/4951
- CPC H01L23/49551
- CPC H01L24/08
- CPC H01L25/0657
- CPC H01L2224/08145
- CPC H01L2224/08245
- CPC H01L2224/48138
- CPC H01L2224/48177
- CPC H01L2225/0651
- CPC H01L2225/06527
- CPC H01L2924/0665
- CPC H01L2924/182
- CPC G06F3/0656
- CPC G06F3/0604
- CPC G06F3/0659
- CPC G06F3/067
- CPC G06F30/392
- CPC H04L25/03057
- CPC H10N10/17
- CPC H01L23/38
- CPC H01L23/42
- CPC H10N10/82
- CPC G06F8/65
- CPC H04L67/34
- CPC H04W76/11
- CPC G06F9/4881
- CPC G06F9/485
- Patent Trends by Company in 2025