Underfill for Large Area Attaches for Semiconductor Packages

Abstract: power semiconductor device assemblies are provided. in one example, a power semiconductor device assembly includes a semiconductor device package with one or more terminals. the semiconductor device package comprises one or more wide bandgap semiconductor die. the power semiconductor device assembly includes a support structure. the semiconductor device package is mounted onto the support structure. the power semiconductor device assembly includes an underfill structure. the underfill structure is at least partially on the support structure and the semiconductor device package.

Inventor(s): Sayan Seal

CPC Classification: H01L23/42 (Fillings or auxiliary members in containers {or encapsulations} selected or arranged to facilitate heating or cooling)

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