Samsung electronics co., ltd. (20250062186). SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
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SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20250062186 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
a semiconductor package is provided. the semiconductor package includes a lower redistribution structure, a semiconductor chip on a top surface of the lower redistribution structure, a plurality of conductive posts on a top surface of the lower redistribution structure and spaced apart from the semiconductor chip in a direction parallel to the top surface of the lower redistribution structure, a plurality of capacitors arranged on the top surface of the lower redistribution structure, the plurality of capacitors being between the semiconductor chip and the plurality of conductive posts, and a plurality of thermal interface material layers between the semiconductor chip and the plurality of capacitors.