Taiwan semiconductor manufacturing company, ltd. (20250006587). SEMICONDUCTOR PACKAGE AND METHOD
SEMICONDUCTOR PACKAGE AND METHOD
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Sung-Feng Yeh of Taipei City TW
SEMICONDUCTOR PACKAGE AND METHOD
This abstract first appeared for US patent application 20250006587 titled 'SEMICONDUCTOR PACKAGE AND METHOD
Original Abstract Submitted
a semiconductor package with a dummy die having two layers with different thermal conductivities and the method of forming the same are provided. the semiconductor package may include a first semiconductor die, a first bonding layer on the first semiconductor die, a second semiconductor die bonded to the first bonding layer, and a first dummy die bonded to the first bonding layer. the first dummy die may include a substrate, a material layer between the substrate and the first bonding layer, and a second bonding layer between the material layer and the first bonding layer. the material layer may include a first material with a first thermal conductivity and the second bonding layer may include a second material with a second thermal conductivity different from the first thermal conductivity.