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Category:CPC H01L23/3736
Pages in category "CPC H01L23/3736"
The following 73 pages are in this category, out of 73 total.
1
- 18432197. INTEGRATED CIRCUIT DEVICE INCLUDING A HIGH THERMAL CONDUCTIVITY ELECTRICALLY INSULATING STRUCTURE (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18491207. DEVICES AND METHODS FOR FORMING DEVICES WITH LIDS (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18526697. SEMICONDUCTOR PACKAGE INCLUDING DUMMY PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18553151. INTEGRATION OF BORON ARSENIDE INTO POWER DEVICES AND SEMICONDUCTORS FOR THERMAL MANAGEMENT simplified abstract (The Regents of the University of California)
- 18599383. INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL COMPONENTS (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18661684. ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF (InnoLux Corporation)
- 18790090. PRINTED CIRCUIT BOARD (Samsung Electro-Mechanics Co., Ltd.)
- 18816500. POWER MODULE AND METHOD OF FABRICATING THE SAME (Infineon Technologies AG)
- 18957303. SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD FOR MAKING THE SAME (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 19015583. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF (Taiwan Semiconductor Manufacturing Company, Ltd.)
2
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- Micron technology, inc. (20240347418). MEMORY DEVICE WITH LOW DENSITY THERMAL BARRIER simplified abstract
- Micron Technology, Inc. Patent Application Trends in 2024
- Micron Technology, Inc. patent applications on October 17th, 2024
- MIKUNI CORPORATION Patent Application Trends in 2025
- Mitsubishi Electric Corporation Patent Application Trends in 2024
- MITSUBISHI ELECTRIC CORPORATION Patent Application Trends in 2024
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- Samsung electro-mechanics co., ltd. (20250132224). PRINTED CIRCUIT BOARD
- Samsung Electro-Mechanics Co., Ltd. patent applications on April 24th, 2025
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240266248). SEMICONDUCTOR PACKAGE INCLUDING DUMMY PACKAGE simplified abstract
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on August 8th, 2024
- SiPLP Microelectronics (Chongqing) Limited Patent Application Trends in 2025
- STMicroelectronics International N.V. Patent Application Trends in 2025
- STMicroelectronics International N.V. patent applications on March 6th, 2025
- Sumitomo Electric Industries, Ltd. Patent Application Trends in 2025
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- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan semiconductor manufacturing co., ltd. (20250087553). SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD FOR MAKING THE SAME
- Taiwan semiconductor manufacturing co., ltd. (20250125215). INTEGRATED CIRCUIT DEVICE INCLUDING A HIGH THERMAL CONDUCTIVITY ELECTRICALLY INSULATING STRUCTURE
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on April 17th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 13th, 2025
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20250132223). DEVICES AND METHODS FOR FORMING DEVICES WITH LIDS
- Taiwan semiconductor manufacturing company, ltd. (20250140641). INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL COMPONENTS
- Taiwan semiconductor manufacturing company, ltd. (20250149401). PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on April 24th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 1st, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 8th, 2025
- Telefonaktiebolaget LM Ericsson (PUBL) Patent Application Trends in 2024
- Telefonaktiebolaget LM Ericsson (publ) Patent Application Trends in 2025
- Telefonaktiebolaget LM Ericsson (PUBL) Patent Application Trends in 2025
- Tesla Patent Application Trends in 2024
- Tesla, Inc. Patent Application Trends in 2025
- The Regents of The University Of California Patent Application Trends in 2024
- THE REGENTS OF THE UNIVERSITY OF CALIFORNIA Patent Application Trends in 2024