19015583. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF (Taiwan Semiconductor Manufacturing Company, Ltd.)
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chih-Hao Chen of Taipei City TW
Po-Yuan Cheng of New Taipei City TW
Li-Hui Cheng of New Taipei City TW
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
This abstract first appeared for US patent application 19015583 titled 'PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Original Abstract Submitted
A manufacturing method of a package structure includes: forming a first package component, where the first package component includes a first insulating encapsulation laterally covering semiconductor dies and a redistribution structure formed on the first insulating encapsulation and the semiconductor dies; coupling the first package component to a second package component; forming an underfill layer between the first and second package component, where the underfill layer extends to cover a sidewall of the first package component; forming a metallic layer on opposing surfaces of the semiconductor dies and the first insulating encapsulation by using a jig, where a window of the jig accessibly exposes the opposing surfaces of the semiconductor dies and the first insulating encapsulation, and a peripheral region of the opposing surface of the first insulating encapsulation is shielded by the jig.