18816500. POWER MODULE AND METHOD OF FABRICATING THE SAME (Infineon Technologies AG)
POWER MODULE AND METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
Thomas Schmid of Regensburg DE
[[:Category:Ewald G�nther of Regenstauf DE|Ewald G�nther of Regenstauf DE]][[Category:Ewald G�nther of Regenstauf DE]]
POWER MODULE AND METHOD OF FABRICATING THE SAME
This abstract first appeared for US patent application 18816500 titled 'POWER MODULE AND METHOD OF FABRICATING THE SAME
Original Abstract Submitted
A power module includes a substrate, one or more semiconductor dies mounted to the substrate, a first external power connection electrically connected to a first power terminal of at least one of the one or more semiconductor dies, and an encapsulant at least partially encapsulating the first external power connection. A portion of the first external power connection and at least parts of an outer surface of the substrate are exposed from the encapsulant. A heatsink is mounted to the first external power connection.
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