Pages that link to "Category:Brandon C. Marin of Gilbert AZ US"
The following pages link to Category:Brandon C. Marin of Gilbert AZ US:
Displaying 33 items.
- Intel corporation (20250096053). MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE OVER A GLASS PATCH (← links)
- Intel corporation (20250096143). MICROELECTRONIC ASSEMBLY WITH BRIDGE DIE AND SELECTIVE METALLIZATION LAYERS (← links)
- 18470645. MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE OVER A GLASS PATCH (Intel Corporation) (← links)
- 18470668. MICROELECTRONIC ASSEMBLY WITH BRIDGE DIE AND SELECTIVE METALLIZATION LAYERS (Intel Corporation) (← links)
- Intel corporation (20250105156). INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE COUPLED TO A GLASS CORE BY INTERCONNECTS (← links)
- Intel corporation (20250105209). HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILICON VIA BRIDGES WITH TOP DIE FIRST APPROACH (← links)
- Intel corporation (20250105222). HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILICON VIA BRIDGES WITH TOP DIE LAST APPROACH (← links)
- Intel corporation (20250106983). STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION (← links)
- Intel corporation (20250107112). INDUCTORS FOR SEMICONDUCTOR PACKAGE SUBSTRATES (← links)
- 18473479. INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE COUPLED TO A GLASS CORE BY INTERCONNECTS (Intel Corporation) (← links)
- 18475373. HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILICON VIA BRIDGES WITH TOP DIE FIRST APPROACH (Intel Corporation) (← links)
- 18475326. HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILICON VIA BRIDGES WITH TOP DIE LAST APPROACH (Intel Corporation) (← links)
- 18373457. STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION (Intel Corporation) (← links)
- 18371294. INDUCTORS FOR SEMICONDUCTOR PACKAGE SUBSTRATES (Intel Corporation) (← links)
- Intel corporation (20250112085). APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES (← links)
- Intel corporation (20250112124). DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING (← links)
- Intel corporation (20250112136). GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS (← links)
- Intel corporation (20250112162). DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DIE AND ASSEMBLY THEREOF ON INTEGRATED CIRCUIT PACKAGING (← links)
- Intel corporation (20250112164). CONTROLLING SUBSTRATE BUMP HEIGHT (← links)
- Intel corporation (20250112175). MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES (← links)
- 18375244. APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES (INTEL CORPORATION) (← links)
- 18374555. DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING (INTEL CORPORATION) (← links)
- 18374937. GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS (INTEL CORPORATION) (← links)
- 18375469. DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DIE AND ASSEMBLY THEREOF ON INTEGRATED CIRCUIT PACKAGING (INTEL CORPORATION) (← links)
- 18374932. CONTROLLING SUBSTRATE BUMP HEIGHT (INTEL CORPORATION) (← links)
- 18477638. MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES (INTEL CORPORATION) (← links)
- Intel corporation (20250125307). MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT SOLDER MATERIALS (← links)
- 18985540. MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT SOLDER MATERIALS (Intel Corporation) (← links)
- Intel corporation (20250149455). INTEGRATED CIRCUIT PACKAGES INCLUDING GLASS-CORED SUBSTRATES WITH SELF-ALIGNED THROUGH GLASS VIAS (← links)
- 18503459. INTEGRATED CIRCUIT PACKAGES INCLUDING GLASS-CORED SUBSTRATES WITH SELF-ALIGNED THROUGH GLASS VIAS (Intel Corporation) (← links)
- 20250183182. Microelectronic Assemblie (Unknown Organization) (← links)
- 20250218880. Microelectronic Assemblies W (Intel) (← links)
- 20250218926. Microelectronic Assemblies I (Intel) (← links)