Category:Brandon C. Marin of Gilbert AZ US
Brandon C. Marin
Brandon C. Marin from Gilbert AZ US has applied for patents in technology areas such as H01L23/15, H01L23/498, H01L23/522 with intel corporation.
Patents
Pages in category "Brandon C. Marin of Gilbert AZ US"
The following 33 pages are in this category, out of 33 total.
1
- 18371294. INDUCTORS FOR SEMICONDUCTOR PACKAGE SUBSTRATES (Intel Corporation)
- 18373457. STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION (Intel Corporation)
- 18374555. DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING (INTEL CORPORATION)
- 18374932. CONTROLLING SUBSTRATE BUMP HEIGHT (INTEL CORPORATION)
- 18374937. GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS (INTEL CORPORATION)
- 18375244. APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES (INTEL CORPORATION)
- 18375469. DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DIE AND ASSEMBLY THEREOF ON INTEGRATED CIRCUIT PACKAGING (INTEL CORPORATION)
- 18470645. MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE OVER A GLASS PATCH (Intel Corporation)
- 18470668. MICROELECTRONIC ASSEMBLY WITH BRIDGE DIE AND SELECTIVE METALLIZATION LAYERS (Intel Corporation)
- 18473479. INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE COUPLED TO A GLASS CORE BY INTERCONNECTS (Intel Corporation)
- 18475326. HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILICON VIA BRIDGES WITH TOP DIE LAST APPROACH (Intel Corporation)
- 18475373. HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILICON VIA BRIDGES WITH TOP DIE FIRST APPROACH (Intel Corporation)
- 18477638. MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES (INTEL CORPORATION)
- 18503459. INTEGRATED CIRCUIT PACKAGES INCLUDING GLASS-CORED SUBSTRATES WITH SELF-ALIGNED THROUGH GLASS VIAS (Intel Corporation)
- 18985540. MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT SOLDER MATERIALS (Intel Corporation)
2
I
- Intel corporation (20250096053). MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE OVER A GLASS PATCH
- Intel corporation (20250096143). MICROELECTRONIC ASSEMBLY WITH BRIDGE DIE AND SELECTIVE METALLIZATION LAYERS
- Intel corporation (20250105156). INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE COUPLED TO A GLASS CORE BY INTERCONNECTS
- Intel corporation (20250105209). HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILICON VIA BRIDGES WITH TOP DIE FIRST APPROACH
- Intel corporation (20250105222). HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILICON VIA BRIDGES WITH TOP DIE LAST APPROACH
- Intel corporation (20250106983). STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION
- Intel corporation (20250107112). INDUCTORS FOR SEMICONDUCTOR PACKAGE SUBSTRATES
- Intel corporation (20250112085). APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES
- Intel corporation (20250112124). DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING
- Intel corporation (20250112136). GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
- Intel corporation (20250112162). DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DIE AND ASSEMBLY THEREOF ON INTEGRATED CIRCUIT PACKAGING
- Intel corporation (20250112164). CONTROLLING SUBSTRATE BUMP HEIGHT
- Intel corporation (20250112175). MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES
- Intel corporation (20250125307). MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT SOLDER MATERIALS
- Intel corporation (20250149455). INTEGRATED CIRCUIT PACKAGES INCLUDING GLASS-CORED SUBSTRATES WITH SELF-ALIGNED THROUGH GLASS VIAS