Category:Thomas L. Sounart of Chandler AZ US
Thomas L. Sounart
Thomas L. Sounart from Chandler AZ US has applied for patents in technology areas such as H01L23/00 with intel corporation.
Patents
Pages in category "Thomas L. Sounart of Chandler AZ US"
The following 23 pages are in this category, out of 23 total.
1
- 18473711. SELECTIVE TRANSFER OF OPTICAL AND OPTO-ELECTRONIC COMPONENTS (Intel Corporation)
- 18473905. SELECTIVE LAYER TRANSFER (Intel Corporation)
- 18474043. BLANKET WAFER LASER PRE-EXPOSURE FOR FAST SELECTIVE LAYER TRANSFERS (Intel Corporation)
- 18478391. ARCHITECTURES FOR FACILITATING BONDING IN WAFER-LEVEL SELECTIVE TRANSFERS (INTEL CORPORATION)
- 18478686. SELECTIVE LAYER TRANSFER WITH GLASS PANELS (INTEL CORPORATION)
- 18478770. PROTECTIVE DEBONDING STACK FOR SELECTIVE TRANSFER (INTEL CORPORATION)
- 18478831. SELECTIVE LAYER TRANSFER PROCESS IMPROVEMENTS (INTEL CORPORATION)
- 18478843. SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES (INTEL CORPORATION)
- 18478923. FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS, AND PASSIVES (INTEL CORPORATION)
- 18478932. FINE-GRAIN INTEGRATION OF GROUP III-V DEVICES (INTEL CORPORATION)
- 18478963. REMOVAL OF DEFECTIVE DIES ON DONOR WAFERS FOR SELECTIVE LAYER TRANSFER (INTEL CORPORATION)
I
- Intel corporation (20250006671). SEMICONDUCTOR LAYER WITH DRY DEPOSITION LAYER
- Intel corporation (20250105025). BLANKET WAFER LASER PRE-EXPOSURE FOR FAST SELECTIVE LAYER TRANSFERS
- Intel corporation (20250105046). SELECTIVE LAYER TRANSFER
- Intel corporation (20250105053). SELECTIVE TRANSFER OF OPTICAL AND OPTO-ELECTRONIC COMPONENTS
- Intel corporation (20250108459). PROTECTIVE DEBONDING STACK FOR SELECTIVE TRANSFER
- Intel corporation (20250112067). REMOVAL OF DEFECTIVE DIES ON DONOR WAFERS FOR SELECTIVE LAYER TRANSFER
- Intel corporation (20250112077). ARCHITECTURES FOR FACILITATING BONDING IN WAFER-LEVEL SELECTIVE TRANSFERS
- Intel corporation (20250112188). FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS, AND PASSIVES
- Intel corporation (20250112196). SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES
- Intel corporation (20250112208). SELECTIVE LAYER TRANSFER WITH GLASS PANELS
- Intel corporation (20250112210). FINE-GRAIN INTEGRATION OF GROUP III-V DEVICES
- Intel corporation (20250112218). SELECTIVE LAYER TRANSFER PROCESS IMPROVEMENTS