Category:Kunal R. Parekh of Boise ID US
Kunal R. Parekh
Kunal R. Parekh from Boise ID US has applied for patents in technology areas such as H01L23/00, H01L21/304, H01L21/683 with micron technology, inc..
Patents
Pages in category "Kunal R. Parekh of Boise ID US"
The following 33 pages are in this category, out of 33 total.
1
- 18776197. TECHNIQUES FOR SEMICONDUCTOR DIE COUPLING IN STACKED MEMORY ARCHITECTURES (MICRON TECHNOLOGY, INC.)
- 18788541. STACKED SEMICONDUCTOR DEVICE (Micron Technology, Inc.)
- 18789049. METHODS FOR BONDING WAFERS OF KNOWN GOOD DIES, AND ASSEMBLIES RESULTING FROM SUCH METHODS (Micron Technology, Inc.)
- 18914866. SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE ASSEMBLIES WITH INK-JET PRINTED CONDUCTIVE PADS AND METHODS FOR MAKING THE SAME (MICRON TECHNOLOGY, INC.)
- 18914918. ADDITIVE APPROACHES TO MODIFYING WAFER GEOMETRY (MICRON TECHNOLOGY, INC.)
- 18920749. STACKED SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR DIES OF VARIABLE SIZE (Micron Technology, Inc.)
- 18966391. Integrated Structures (Micron Technology, Inc.)
- 18971871. SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE (Micron Technology, Inc.)
- 19005309. MONOLITHIC CONDUCTIVE COLUMNS IN A SEMICONDUCTOR DEVICE AND ASSOCIATED METHODS (Micron Technology, Inc.)
- 19009060. Integrated Assemblies and Methods of Forming Integrated Assemblies (Micron Technology, Inc.)
- 19009758. Integrated Structures (Micron Technology, Inc.)
- 19013909. Memory Circuitry Comprising a Vertical String of Memory Cells and a Conductive Via and Method Used in Forming a Vertical String of Memory Cells and a Conductive Via (Micron Technology, Inc.)
- 19019070. METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED ELECTRONIC SYSTEMS (Micron Technology, Inc.)
2
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- Micron technology, inc. (20250006251). SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE FOR MODE BASED OPERATIONS
- Micron technology, inc. (20250006704). SEMICONDUCTOR DEVICE WITH A SPACED SUPPLY VOLTAGE AND GROUND REFERENCE
- Micron technology, inc. (20250008750). SEMICONDUCTOR DEVICE WITH A THROUGH VIA BETWEEN REDISTRIBUTION LAYERS
- Micron technology, inc. (20250096171). METHODS FOR BONDING WAFERS OF KNOWN GOOD DIES, AND ASSEMBLIES RESULTING FROM SUCH METHODS
- Micron technology, inc. (20250096202). STACKED SEMICONDUCTOR DEVICE
- Micron technology, inc. (20250098169). Integrated Structures
- Micron technology, inc. (20250104761). SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE
- Micron technology, inc. (20250118693). TECHNIQUES FOR SEMICONDUCTOR DIE COUPLING IN STACKED MEMORY ARCHITECTURES
- Micron technology, inc. (20250132209). SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE ASSEMBLIES WITH INK-JET PRINTED CONDUCTIVE PADS AND METHODS FOR MAKING THE SAME
- Micron technology, inc. (20250133786). ADDITIVE APPROACHES TO MODIFYING WAFER GEOMETRY
- Micron technology, inc. (20250140753). STACKED SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR DIES OF VARIABLE SIZE
- Micron technology, inc. (20250140756). MONOLITHIC CONDUCTIVE COLUMNS IN A SEMICONDUCTOR DEVICE AND ASSOCIATED METHODS
- Micron technology, inc. (20250142820). Integrated Assemblies and Methods of Forming Integrated Assemblies
- Micron technology, inc. (20250142827). Integrated Structures
- Micron technology, inc. (20250149382). METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED ELECTRONIC SYSTEMS
- Micron technology, inc. (20250151274). Memory Circuitry Comprising a Vertical String of Memory Cells and a Conductive Via and Method Used in Forming a Vertical String of Memory Cells and a Conductive Via