18788541. STACKED SEMICONDUCTOR DEVICE (Micron Technology, Inc.)
STACKED SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Bret K. Street of Meridian ID US
Akshay N. Singh of Boise ID US
Kunal R. Parekh of Boise ID US
STACKED SEMICONDUCTOR DEVICE
This abstract first appeared for US patent application 18788541 titled 'STACKED SEMICONDUCTOR DEVICE
Original Abstract Submitted
A semiconductor device assembly is provided. The semiconductor device assembly includes a logic die, a first plurality of stacked memory dies electrically coupled with the logic die, and a second plurality of stacked memory dies mounted on and electrically coupled with the first plurality of stacked memory dies. A first dielectric material is disposed around the first plurality of stacked memory dies. A second dielectric material is disposed at the first dielectric material and surrounding the second plurality of stacked memory dies. A third dielectric material is disposed between the first plurality of stacked memory dies and the second plurality of stacked memory dies and between the first dielectric material and the second dielectric material.