Category:Gang DUAN of Chandler AZ US
Gang DUAN
Gang DUAN from Chandler AZ US has applied for patents in technology areas such as [[:Category:the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({ takes precedence; manufacture or treatment } ; mountings per se ; {materials })|the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({ takes precedence; manufacture or treatment } ; mountings per se ; {materials })]] with Intel Corporation.
Patents
[[Category:the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({ takes precedence; manufacture or treatment } ; mountings per se ; {materials })]]
Pages in category "Gang DUAN of Chandler AZ US"
The following 16 pages are in this category, out of 16 total.
2
- 20250183179. Passive Structures Embedd (Intel)
- 20250183180. Direct Bonding Embedded (Intel)
- 20250216636. Optical Bridge Photonic (Intel)
- 20250218879. Resist Tenting Plating I (Intel)
- 20250218885. Patterned Mold Underfill (mu (Intel)
- 20250218898. Reconstituted Passive M (Intel)
- 20250218906. Reconstituted Passive Assemb (Intel)
- 20250218952. Spacer Embedded Componen (Intel)
- 20250218959. Pad Design Embedded Inte (Intel)
- 20250218965. Self Alignment Structures Fo (Intel)
- 20250218988. Direct Bond Interconnect Arc (Intel)
- 20250218998. Low Temperature Solder Inter (Intel)
- 20250218999. Passive Component Assembly F (Intel)
- 20250219040. Technologies Components (Intel)
- 20250220818. Flow Enhanced Dummy Structur (Intel)
- 20250703 Patent Applications Report for July 3rd, 2025