20250218906. Reconstituted Passive Assemb (Intel)
RECONSTITUTED PASSIVE ASSEMBLIES FOR EMBEDDING IN THICK CORES
Abstract: embodiments disclosed herein include apparatuses with assemblies comprising passive electrical devices that are embedded in a core of a package substrate. in an embodiment, such an apparatus may comprise a substrate with a first surface, a second surface opposite from the first surface, and a sidewall surface coupling the first surface to the second surface. in an embodiment the substrate comprises a passive electrical device. in an embodiment, a pad is on the first surface of the substrate, and a layer contacts the substrate. in an embodiment, the layer directly contacts the first surface and the sidewall surface of the substrate.
Inventor(s): Zhixin XIE, Ziqing HAN, Srinivas Venkata Ramanuja PIETAMBARAM, Jung Kyu HAN, Gang DUAN, Yingying ZHANG, Minglu LIU, Manni MO, Kyle ARRINGTON, Clay ARRINGTON, Bohan SHAN, Ryan CARRAZZONE, Yiqun BAI, Ziyin LIN, Jose WAIMIN, Dingying David XU, Hongxia FENG, Yongki MIN, Brandon C. MARIN
CPC Classification: H01L23/4821 (consisting of lead-in layers inseparably applied to the semiconductor body {(electrodes )})
Search for rejections for patent application number 20250218906
- Patent Applications
- Intel Corporation
- CPC H01L23/4821
- Zhixin XIE of Chandler AZ US
- Ziqing HAN of Los Angeles CA US
- Srinivas Venkata Ramanuja PIETAMBARAM of Chandler AZ US
- Jung Kyu HAN of Chandler AZ US
- Gang DUAN of Chandler AZ US
- Yingying ZHANG of Phoenix AZ US
- Minglu LIU of Chandler AZ US
- Manni MO of Maricopa AZ US
- Kyle ARRINGTON of Gilbert AZ US
- Clay ARRINGTON of Queen Creek AZ US
- Bohan SHAN of Chandler AZ US
- Ryan CARRAZZONE of Chandler AZ US
- Yiqun BAI of Chandler AZ US
- Ziyin LIN of Chandler AZ US
- Jose WAIMIN of Gilbert AZ US
- Dingying David XU of Chandler AZ US
- Hongxia FENG of Chandler AZ US
- Yongki MIN of Phoenix AZ US
- Brandon C. MARIN of Gilbert AZ US