PASSIVE COMPONENT ASSEMBLY FOR THICKNESS MODIFICATION TO MATCH CORE THICKNESS

Abstract: embodiments disclosed herein include passive electrical components with thickness modifications. in an embodiment, such an apparatus may comprise a first substrate with a first material composition, where the first substrate comprises a passive electrical device. in an embodiment, a second substrate is coupled to the first substrate, where the second substrate has a second material composition. in an embodiment, a layer is over a surface of the second substrate opposite from the first substrate, and the layer is electrically insulating.

Inventor(s): Bohan SHAN, Hongxia FENG, Jose WAIMIN, Ryan CARRAZZONE, Kyle ARRINGTON, Ziyin LIN, Dingying David XU, Yongki MIN, Srinivas Venkata Ramanuja PIETAMBARAM, Gang DUAN, Wei LI, Ashay DANI, Leonel R. ARANA, Brandon C. MARIN, Clay ARRINGTON, Hiroki TANAKA, Haobo CHEN, Mohit GUPTA

CPC Classification: H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application))

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