Technologies for Components Embedded in a Substrate Core

Abstract: technologies for components embedded in a substrate core are disclosed. in one embodiment, power components such as deep trench capacitors are disposed in a cavity defined in a substrate core for a circuit board of an integrated circuit package, such as a processor. the power components are stacked on top of each other, allowing for the stack of power components to match the height of the substrate core, even when the height of the individual power components is less than the height of the substrate core. configuring the power components in this manner can provide mechanical stability to the power components and substrate core and provide power to a semiconductor die mounted on the circuit board.

Inventor(s): Tolga ACIKALIN, Soham AGARWAL, Benjamin T. DUONG, Jeremy D. ECTON, Kari E. HERNANDEZ, Brandon Christian MARIN, Pratyush MISHRA, Pratyasha MOHAPATRA, Srinivas Venkata Ramanuja PIETAMBARAM, Marcel M. SAID, Suddhasattwa NAD, Gang DUAN, Zhixin XIE, Jung Kyu HAN, Mohamed R. SABER, Shuren QU, Naiya SOETAN-DODD, Teng SUN, Yuxin FANG

CPC Classification: H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups - , or in a single subclass of ,)

Search for rejections for patent application number 20250219040