20250220818. Flow Enhanced Dummy Structur (Intel)
FLOW ENHANCED DUMMY STRUCTURE TO ENABLE CAPILLARY FLOW BASED SIDEWALL FILLING
Abstract: embodiments disclosed herein include an apparatus with a component embedded in a core. apparatuses disclosed herein may comprise a first component with a first surface and a second surface opposite from the first surface, where a pad is provided on the first surface. in an embodiment, a layer is over the second surface of the first component, and a second component is over the layer. in an embodiment, the second component comprises a hole that passes through at least a partial thickness of the second component.
Inventor(s): Bohan SHAN, Wei LI, Jose WAIMIN, Ryan CARRAZZONE, Kyle ARRINGTON, Ziyin LIN, Hongxia FENG, Yiqun BAI, Haobo CHEN, Dingying David XU, Yongki MIN, Clay ARRINGTON, Srinivas Venkata Ramanuja PIETAMBARAM, Gang DUAN, Xiaoying GUO
CPC Classification: H05K1/185 (Printed circuits structurally associated with non-printed electric components ({, , , and} take precedence))
Search for rejections for patent application number 20250220818
- Patent Applications
- Intel Corporation
- CPC H05K1/185
- Bohan SHAN of Chandler AZ US
- Wei LI of Chandler AZ US
- Jose WAIMIN of Gilbert AZ US
- Ryan CARRAZZONE of Chandler AZ US
- Kyle ARRINGTON of Gilbert AZ US
- Ziyin LIN of Chandler AZ US
- Hongxia FENG of Chandler AZ US
- Yiqun BAI of Chandler AZ US
- Haobo CHEN of Chandler AZ US
- Dingying David XU of Chandler AZ US
- Yongki MIN of Phoenix AZ US
- Clay ARRINGTON of Queen Creek AZ US
- Srinivas Venkata Ramanuja PIETAMBARAM of Chandler AZ US
- Gang DUAN of Chandler AZ US
- Xiaoying GUO of Chandler AZ US