RECONSTITUTED PASSIVE WITH MECHANICAL SUPPORT STRUCTURES

Abstract: embodiments disclosed herein include components that include passive electrical devices with a thickness augmentation. in an embodiment, such an apparatus comprises a substrate with a first material composition, and a liner on a sidewall of the substrate. in an embodiment, a layer is on the substrate, where the layer has a second material composition that is different than the first material composition. in an embodiment, the layer directly contacts at least a portion of a surface of the substrate.

Inventor(s): Jeremy D. ECTON, Brandon C. MARIN, Srinivas Venkata Ramanuja PIETAMBARAM, Gang DUAN, Benjamin DUONG

CPC Classification: H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor})

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