20250218965. Self Alignment Structures Fo (Intel)
SELF ALIGNMENT STRUCTURES FOR INTERCONNECT BRIDGES
Abstract: assemblies that include package substrates and semiconductor chips are provided. the package substrates include interconnect bridges having through-bridge vias. the assemblies also include alignment features and receiving cavities.
Inventor(s): Brandon C. MARIN, Jeremy D. ECTON, Srinivas PIETAMBARAM, Gang DUAN
CPC Classification: H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({ takes precedence; manufacture or treatment } ; mountings per se ; {materials }))
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