20250218952. Spacer Embedded Componen (Intel)
SPACER FOR EMBEDDED COMPONENT IN CORE
Abstract: embodiments disclosed herein include components that are embedded within a core of a package substrate. in an embodiment, such an apparatus may comprise a substrate with a first surface and a second surface opposite from the first surface. in an embodiment, a cavity is provided through a thickness of the substrate, and a first layer is in the cavity. in an embodiment, the first layer has a first width. in an embodiment, a component is on the first layer, and the component has a second width that is smaller than the first width. in an embodiment, a second layer is provided between a sidewall of the cavity and a sidewall of the component.
Inventor(s): Benjamin DUONG, Tolga ACIKALIN, Soham AGARWAL, Jeremy D. ECTON, Kari HERNANDEZ, Brandon C. MARIN, Pratyush MISHRA, Pratyasha MOHAPATRA, Srinivas Venkata Ramanuja PIETAMBARAM, Marcel SAID, Bohan SHAN, Gang DUAN
CPC Classification: H01L23/5381 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({ takes precedence; manufacture or treatment } ; mountings per se ; {materials }))
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- Patent Applications
- Intel Corporation
- CPC H01L23/5381
- Benjamin DUONG of Phoenix AZ US
- Tolga ACIKALIN of San Jose CA US
- Soham AGARWAL of Chandler AZ US
- Jeremy D. ECTON of Gilbert AZ US
- Kari HERNANDEZ of Phoenix AZ US
- Brandon C. MARIN of Gilbert AZ US
- Pratyush MISHRA of Tempe AZ US
- Pratyasha MOHAPATRA of Hillsboro OR US
- Srinivas Venkata Ramanuja PIETAMBARAM of Chandler AZ US
- Marcel SAID of Beaverton OR US
- Bohan SHAN of Chandler AZ US
- Gang DUAN of Chandler AZ US