RESIST TENTING AND PLATING IN CORE CAVITY FOR COMPONENT ATTACHMENT

Abstract: embodiments disclosed herein include components that are embedded within a core of a package substrate. in an embodiment, the component is supported on a pad provided at a bottom of a cavity through the core. in an embodiment, such an apparatus may comprise a substrate with a cavity through a thickness of the substrate. in an embodiment, the cavity comprises sidewalls. in an embodiment, a layer spans an opening of the cavity, and the layer covers at least a portion of the sidewalls of the cavity. in an embodiment, a component is coupled to the layer, and the component is at least partially within the cavity.

Inventor(s): Hiroki TANAKA, Kyle MCELHINNY, Robert Alan MAY, Bai NIE, Bohan SHAN, Srinivas Venkata Ramanuja PIETAMBARAM, Gang DUAN

CPC Classification: H01L23/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application))

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