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Category:CPC H01L21/7682
Pages in category "CPC H01L21/7682"
The following 88 pages are in this category, out of 88 total.
1
- 18162103. SEMICONDUCTOR DEVICE HAVING AIR GAP AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18171839. SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18185481. AIR GAP IN BEOL INTERCONNECT simplified abstract (International Business Machines Corporation)
- 18187738. TOP VIA INTERCONNECT simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18190024. BACK-END-OF-LINE (BEOL) INTERCONNECTS WITH DIFFERENT AIRGAP HEIGHTS AND METAL TRACE CORNER PROTECTION STRUCTURES simplified abstract (QUALCOMM Incorporated)
- 18380478. AIR GAP STRUCTURE IN INTERCONNECT WITH TOP VIA (International Business Machines Corporation)
- 18420209. Methods of Forming Spacers for Semiconductor Devices Including Backside Power Rails simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18430150. INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUCTIVITY (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18438653. INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE DIELECTRIC LAYER HAVING AIR GAP simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18484470. SELF-ALIGNED TOPVIA AND METAL LINE WITH INCREASED HEIGHT (International Business Machines Corporation)
- 18598173. SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD FOR PREPARING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18603483. SEMICONDUCTOR DEVICE STRUCTURES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18612386. INTERCONNECT STRUCTURE WITH HIGH THERMAL CONDUCTIVITY AND LOW PARASITIC CAPACITANCE (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18649541. SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18675406. SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18745872. METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING VOIDS NEIGHBORING CONDUCTIVE CONTACTS, AND RELATED ELECTRONIC SYSTEMS simplified abstract (Micron Technology, Inc.)
- 18751628. SEMICONDUCTOR DEVICE STRUCTURE WITH INTERCONNECT STRUCTURE HAVING AIR GAP simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18968357. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18989089. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (Taiwan Semiconductor Manufacturing Co., Ltd.)
2
- 20250167042. Semiconductor Device Having Low Dielectric Capacitance, Method Manufacturing S (Taiwan Semiconductor Manufacturing , .)
- 20250167043. Interconnect Str (Samsung Electronics ., .)
- 20250174492. I (Taiwan Semiconductor Manufacturing ., .)
- 20250218864. Semiconductor Dev (NANYA TECHNOLOGY)
- 20250218865. Semiconductor Device Manufacturing Method Ther (Taiwan Semiconductor Manufacturing , .)
I
- IMEC VZW Patent Application Trends in 2025
- International business machines corporation (20240312834). AIR GAP IN BEOL INTERCONNECT simplified abstract
- International business machines corporation (20240321630). TOP VIA INTERCONNECT simplified abstract
- International business machines corporation (20250125192). AIR GAP STRUCTURE IN INTERCONNECT WITH TOP VIA
- International business machines corporation (20250125193). SELF-ALIGNED TOPVIA AND METAL LINE WITH INCREASED HEIGHT
- International Business Machines Corporation Patent Application Trends in 2025
- International Business Machines Corporation patent applications on April 17th, 2025
- International Business Machines Corporation patent applications on September 19th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on September 26th, 2024
M
- Micron technology, inc. (20240266213). Semiconductor Device and Method of Forming the Same simplified abstract
- Micron technology, inc. (20240339357). METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING VOIDS NEIGHBORING CONDUCTIVE CONTACTS, AND RELATED ELECTRONIC SYSTEMS simplified abstract
- Micron Technology, Inc. patent applications on August 8th, 2024
- Micron Technology, Inc. patent applications on October 10th, 2024
Q
- Qualcomm incorporated (20240321631). BACK-END-OF-LINE (BEOL) INTERCONNECTS WITH DIFFERENT AIRGAP HEIGHTS AND METAL TRACE CORNER PROTECTION STRUCTURES simplified abstract
- Qualcomm Incorporated Patent Application Trends in 2025
- Qualcomm incorporated Patent Application Trends in 2025
- QUALCOMM Incorporated patent applications on September 26th, 2024
S
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SONY GROUP CORPORATION Patent Application Trends in 2024
T
- Tahoe Research, Ltd. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan semiconductor manufacturing co., ltd. (20240249976). SEMICONDUCTOR DEVICE STRUCTURES simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312835). SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20250096038). SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Taiwan semiconductor manufacturing co., ltd. (20250118595). INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUCTIVITY
- Taiwan semiconductor manufacturing co., ltd. (20250118596). SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on April 10th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 25th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 20th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications on September 19th, 2024
- Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240258158). INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE INTERCONNECTION STRUCTURE HAVING AIR GAP
- Taiwan semiconductor manufacturing company, ltd. (20240258158). INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE INTERCONNECTION STRUCTURE HAVING AIR GAP simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266212). SEMICONDUCTOR DEVICE HAVING AIR GAP AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282622). SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282623). SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240339356). INSULATING CAP ON CONTACT STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347381). SEMICONDUCTOR DEVICE STRUCTURE WITH INTERCONNECT STRUCTURE HAVING AIR GAP simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379413). INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379414). AIR SPACER SURROUNDING CONDUCTIVE FEATURES AND METHOD FORMING SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250140605). INTERCONNECT STRUCTURE WITH HIGH THERMAL CONDUCTIVITY AND LOW PARASITIC CAPACITANCE
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 1st, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 22nd, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 8th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 1st, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 10th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 17th, 2024
- TOKYO ELECTRON LIMITED Patent Application Trends in 2024
- Tokyo Electron Limited Patent Application Trends in 2024