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Category:Eng Huat Goh of Ayer Itam (MY)
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Pages in category "Eng Huat Goh of Ayer Itam (MY)"
The following 11 pages are in this category, out of 11 total.
1
- 17848059. INTEGRATED CIRCUIT PACKAGE WITH PSEUDO-STRIPLINE ARCHITECTURE simplified abstract (Intel Corporation)
- 17848607. ELECTRICALLY CONDUCTIVE STRIPS ON A SIDE OF A MEMORY MODULE simplified abstract (Intel Corporation)
- 17848630. HYPER DENSITY PACKAGE SUBSTRATE AND MEMORY COUPLED TO A MODIFIED SEMI-ADDITIVE PROCESS BOARD simplified abstract (Intel Corporation)
- 17848639. SLOTTED STIFFENER FOR A PACKAGE SUBSTRATE simplified abstract (Intel Corporation)
- 17848643. ELECTRICAL CONDUCTOR EXTENDING FROM A SURFACE OF A SUBSTRATE simplified abstract (Intel Corporation)
- 17849352. COPPER RINGS FOR BGA COUNT REDUCTION IN SMALL FORM FACTOR PACKAGES simplified abstract (Intel Corporation)
- 17956753. DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE simplified abstract (Intel Corporation)
- 18400784. STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE simplified abstract (Intel Corporation)
I
- Intel corporation (20240106139). CONNECTOR TO ELECTRICALLY COUPLE MULTIPLE SUBSTRATES simplified abstract
- Intel corporation (20240113033). DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE simplified abstract
- Intel corporation (20240136278). STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE simplified abstract