Intel corporation (20240136278). STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE simplified abstract
Contents
- 1 STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE
Organization Name
Inventor(s)
Eng Huat Goh of Ayer Itam (MY)
Amruthavalli Pallavi Alur of Tempe AZ (US)
Debendra Mallik of Chandler AZ (US)
STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136278 titled 'STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE
Simplified Explanation
The abstract describes a patent application for an embedded multi-die interconnect bridge (EMIB) that is fabricated on a substrate using photolithographic techniques. The EMIB is then separated from the substrate and placed on the penultimate layer of an integrated-circuit package substrate, below the top solder-resist layer. The low z-height of the EMIB allows for useful trace and via real estate below it to be employed in the package substrate.
- Fabrication of embedded multi-die interconnect bridge (EMIB) on a substrate using photolithographic techniques
- Separation of EMIB from the substrate and placement on the penultimate layer of an integrated-circuit package substrate
- Low z-height of the EMIB allows for utilization of trace and via real estate below it in the package substrate
Potential Applications
The technology could be used in:
- High-performance computing
- Data centers
- Networking equipment
Problems Solved
- Efficient use of real estate in integrated-circuit package substrates
- Improved interconnectivity between multiple dies
- Enhanced performance and reliability of electronic devices
Benefits
- Increased functionality in a compact space
- Enhanced signal integrity
- Cost-effective manufacturing process
Potential Commercial Applications
Optimizing space in:
- Mobile devices
- Internet of Things (IoT) devices
- Automotive electronics
Possible Prior Art
One possible prior art could be the use of multi-die interconnect technologies in semiconductor packaging.
Unanswered Questions
What are the specific photolithographic techniques used in fabricating the EMIB?
The article does not provide detailed information on the specific photolithographic techniques employed in the fabrication process.
How does the separation of the EMIB from the substrate impact the overall performance of the integrated-circuit package?
The article does not delve into the specific performance implications of separating the EMIB from the substrate.
Original Abstract Submitted
an embedded multi-die interconnect bridge (emib) is fabricated on a substrate using photolithographic techniques, and the emib is separated from the substrate and placed on the penultimate layer of an integrated-circuit package substrate, below the top solder-resist layer. a low z-height of the emib, allows for useful trace and via real estate below the emib, to be employed in the package substrate.
