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Category:H01L27/146
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Pages in category "H01L27/146"
The following 200 pages are in this category, out of 825 total.
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- Samsung electronics co., ltd. (20240258347). IMAGE SENSOR WITH STACK STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- Samsung electronics co., ltd. (20240258350). IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240258351). IMAGE SENSOR INCLUDING AUTO-FOCUS PIXELS simplified abstract
- Samsung electronics co., ltd. (20240258352). IMAGE SENSOR simplified abstract
- Samsung electronics co., ltd. (20240258353). IMAGE SENSOR AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240258354). IMAGE SENSOR AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240266376). IMAGE SENSOR AND A METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240274628). IMAGE SENSOR INCLUDING COLOR SEPARATING LENS ARRAY, INCLUDING REGIONS OF DIFFERENT PATTERNS, AND ELECTRONIC APPARATUS INCLUDING THE IMAGE SENSOR simplified abstract
- Samsung electronics co., ltd. (20240274629). IMAGE SENSOR simplified abstract
- Samsung electronics co., ltd. (20240274633). IMAGE SENSOR AND MANUFACTURING METHOD THEREOF simplified abstract
- Samsung electronics co., ltd. (20240274638). CMOS IMAGE SENSORS simplified abstract
- Samsung electronics co., ltd. (20240282788). INTEGRATED CIRCUIT AND IMAGE SENSOR INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240282790). IMAGE SENSOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240282792). IMAGE SENSOR simplified abstract
- Samsung electronics co., ltd. (20240282795). IMAGE SENSOR simplified abstract
- Samsung electronics co., ltd. (20240282796). IMAGE SENSOR AND METHOD OF MANUFACTURING THEREOF simplified abstract
- Samsung electronics co., ltd. (20240282800). IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240290808). IMAGE SENSORS HAVING HIGH DENSITY SUBPIXELS THEREIN WITH ENHANCED PIXEL SEPARATION STRUCTURES simplified abstract
- Samsung electronics co., ltd. (20240290812). IMAGE SENSOR simplified abstract
- Samsung electronics co., ltd. (20240297189). IMAGE SENSOR INCLUDING COLOR FILTER GRID INCLUDING PORTION OVERLAPPING SUPER PHASE DETECTION (PD) PIXEL simplified abstract
- Samsung electronics co., ltd. (20240304637). IMAGE SENSORS AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240313016). IMAGE SENSOR AND MANUFACTURING METHOD FOR AN IMAGE SENSOR REFLECTIVE LAYER simplified abstract
- Samsung electronics co., ltd. (20240313018). IMAGE SENSOR AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240321910). IMAGE SENSOR simplified abstract
- Samsung electronics co., ltd. (20240321911). IMAGE SENSOR AND MANUFACTURING METHOD THEREOF simplified abstract
- Samsung electronics co., ltd. (20240321913). IMAGE SENSOR simplified abstract
- Samsung electronics co., ltd. (20240321914). COMPOUND, PHOTOELECTRIC DEVICE, LIGHT ABSORPTION SENSOR, SENSOR-EMBEDDED DISPLAY PANEL, AND ELECTRONIC DEVICE simplified abstract
- Samsung electronics co., ltd. (20240321921). IMAGE SENSOR INCLUDING DEVICE ISOLATION STRUCTURE simplified abstract
- Samsung electronics co., ltd. (20240321922). PIXEL, PIXEL ARRAY, AND IMAGE SENSORS INCLUDING THE PIXEL simplified abstract
- Samsung electronics co., ltd. (20240321923). IMAGE SENSOR simplified abstract
- Samsung electronics co., ltd. (20240321926). IMAGE SENSORS simplified abstract
- Samsung electronics co., ltd. (20240321930). IMAGE SENSOR simplified abstract
- Samsung electronics co., ltd. (20240322051). OUTPUT CIRCUIT FOR SPAD simplified abstract
- Samsung electronics co., ltd. (20240323571). IMAGE SENSOR AND CAMERA MODULE INCLUDING THE SAME simplified abstract
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 11th, 2024
- Samsung Electronics Co., Ltd. patent applications on April 18th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on April 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on April 4th, 2024
- Samsung Electronics Co., Ltd. patent applications on August 15th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on August 15th, 2024
- Samsung Electronics Co., Ltd. patent applications on August 1st, 2024
- Samsung Electronics Co., Ltd. patent applications on August 22nd, 2024
- Samsung Electronics Co., Ltd. patent applications on August 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on August 29th, 2024
- Samsung Electronics Co., Ltd. patent applications on August 8th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 15th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 1st, 2024
- Samsung Electronics Co., Ltd. patent applications on February 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 8th, 2024
- Samsung Electronics Co., Ltd. patent applications on January 18th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on July 11th, 2024
- Samsung Electronics Co., Ltd. patent applications on July 18th, 2024
- Samsung Electronics Co., Ltd. patent applications on July 25th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on July 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on July 4th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on July 4th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 13th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 13th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 20th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 20th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 27th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 6th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 6th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 14th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
- Samsung Electronics Co., Ltd. patent applications on May 16th, 2024
- Samsung Electronics Co., Ltd. patent applications on May 30th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 12th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 19th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on September 19th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 26th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 5th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on September 5th, 2024
- Semiconductor energy laboratory co., ltd. (20240266378). IMAGING DEVICE AND ELECTRONIC DEVICE simplified abstract
- Semiconductor energy laboratory co., ltd. (20240266444). SEMICONDUCTOR DEVICE simplified abstract
- Semiconductor Energy Laboratory Co., Ltd. patent applications on August 8th, 2024
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. patent applications on January 25th, 2024
- Sk hynix inc. (20240243152). SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Sk hynix inc. (20240264281). IMAGE SENSING DEVICE simplified abstract
- Sk hynix inc. (20240282784). IMAGE SENSING DEVICE FOR CORRECTING DEPTH INFORMATION simplified abstract
- Sk hynix inc. (20240282786). IMAGE SENSING DEVICE simplified abstract
- Sk hynix inc. (20240313023). IMAGE SENSING DEVICE simplified abstract
- Sk hynix inc. (20240323527). IMAGE SENSING DEVICE simplified abstract
- SK hynix Inc. patent applications on August 22nd, 2024
- SK hynix Inc. patent applications on August 8th, 2024
- SK hynix Inc. patent applications on January 18th, 2024
- SK hynix Inc. patent applications on July 18th, 2024
- SK hynix Inc. patent applications on September 19th, 2024
- SK hynix Inc. patent applications on September 26th, 2024
- Sony group corporation (20240244855). SOLID-STATE IMAGING APPARATUS AND ELECTRONIC APPARATUS simplified abstract
- Sony group corporation (20240266379). SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE, SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS simplified abstract
- Sony group corporation (20240313013). SOLID-STATE IMAGING ELEMENT AND MANUFACTURING METHOD THEREOF simplified abstract
- Sony group corporation (20240321927). IMAGING DEVICE, MANUFACTURING METHOD, AND ELECTRONIC DEVICE simplified abstract
- SONY GROUP CORPORATION patent applications on August 8th, 2024
- Sony Group Corporation patent applications on February 15th, 2024
- Sony Group Corporation patent applications on July 18th, 2024
- SONY GROUP CORPORATION patent applications on September 19th, 2024
- Sony Group Corporation patent applications on September 26th, 2024
- Sony semiconductor solutions corporation (20240321912). SOLID-STATE IMAGING ELEMENT, MANUFACTURING METHOD, AND ELECTRONIC EQUIPMENT simplified abstract
- Sony semiconductor solutions corporation (20240321917). IMAGING DEVICE simplified abstract
- Sony semiconductor solutions corporation (20240321918). SOLID-STATE IMAGING ELEMENT AND ELECTRONIC EQUIPMENT simplified abstract
- Sony semiconductor solutions corporation (20240321919). SOLID-STATE IMAGING ELEMENT AND ELECTRONIC EQUIPMENT simplified abstract
- Sony semiconductor solutions corporation (20240321929). SOLID-STATE IMAGING DEVICE AND ELECTRONIC EQUIPMENT simplified abstract
- Sony semiconductor solutions corporation (20240323556). SOLID-STATE IMAGING DEVICE, PACKAGE, AND IMAGING SYSTEM simplified abstract
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION patent applications on September 26th, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20240096784). EXTENDED VIA CONNECT FOR PIXEL ARRAY simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096918). IMAGE SENSOR PACKAGING AND METHODS FOR FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240162264). DEVICE OVER PHOTODETECTOR PIXEL SENSOR simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240162269). BOND PAD STRUCTURE FOR BONDING IMPROVEMENT simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240186356). IMAGE SENSOR simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240194716). TAPERED BACKSIDE GROUND STRUCTURE FOR PIXEL ARRAY simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240194730). Interconnect Layout for Semiconductor Device simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240222407). STACKED STRUCTURE FOR CMOS IMAGE SENSORS simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240250098). IMAGE SENSOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240313010). SEMICONDUCTOR IMAGING DEVICE HAVING IMPROVED DARK CURRENT PERFORMANCE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240313026). METHOD FOR FABRICATING HYBRID BONDED STRUCTURE simplified abstract
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on February 1st, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on January 25th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 25th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 4th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 13th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 6th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on May 16th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications on September 19th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240105750). CMOS IMAGE SENSOR simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105751). SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105877). Germanium-Based Sensor with Junction-Gate Field Effect Transistor and Method of Fabricating Thereof simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240113143). SHIFTED MICRO-LENSES FOR INCREASED IMAGING DEVICE PERFORMANCE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240120363). PIXEL SENSOR ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136383). SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240178263). DUAL FACING BSI IMAGE SENSORS WITH WAFER LEVEL STACKING simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240178264). INTEGRATED CIRCUIT PHOTODETECTOR simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240204016). VERTICAL GATE FIELD EFFECT TRANSISTOR simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240204024). METHOD OF MAKING A SEMICONDUCTOR IMAGE SENSOR HAVING REFLECTION COMPONENT simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240204032). IMAGE SENSOR WITH IMPROVED LIGHT CONVERSION EFFICIENCY simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240234460). PIXEL SENSORS AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240234487). DEEP TRENCH CAPACITORS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240243156). HIGH ASPECT RATIO BACK SIDE DEEP TRENCH ISOLATON STRUCTURE WITH SUBSTRATE-EMBEDDED METAL GRID AND NO PINCH OFF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266341). HYBRID BONDING WITH UNIFORM PATTERN DENSITY simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266371). INTEGRATED CIRCUIT WITH AND METHOD FOR CONNECTION OF A PLURALITY OF FLOATING DIFFUSION REGIONS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266375). FRONTSIDE DEEP TRENCH ISOLATION (FDTI) STRUCTURE FOR CMOS IMAGE SENSOR simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266380). STEPPED BACK SIDE DEEP TRENCH ISOLATON STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282582). METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282797). PIXEL DEVICE ON DEEP TRENCH ISOLATION (DTI) STRUCTURE FOR IMAGE SENSOR simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282799). IMAGE SENSOR WITH TRANSISTOR HAVING HIGH RELATIVE PERMITTIVITY simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240290740). ISOLATION STRUCTURE FOR BOND PAD STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240290806). ABSORPTION ENHANCEMENT STRUCTURE TO INCREASE QUANTUM EFFICIENCY OF IMAGE SENSOR simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240290810). PIXEL WITH DUAL-PD LAYOUT simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240290811). IMAGE SENSOR INTEGRATED CHIP STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304653). HIGH ABSORPTION STRUCTURE FOR OPTOELECTRONIC DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321933). IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240323555). IMAGE SENSOR DEVICE AND METHODS OF FORMATION simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 11th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 25th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on April 4th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 22nd, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on August 29th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 8th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 15th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 29th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 8th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 18th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on July 11th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on July 18th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on June 20th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on March 28th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 30th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 12th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 26th, 2024
- The regents of the university of california (20240297199). SINGLE PHOTON COLOR IMAGE SENSOR simplified abstract
- The Regents of the University of California patent applications on September 5th, 2024
U
- US Patent Application 17752586. PIXEL WITH DIFFRACTIVE SCATTERING GRATING AND HIGH COLOR RESOLUTION ASSIGNING SIGNAL PROCESSING simplified abstract
- US Patent Application 17824183. OPTICAL BIOSENSOR DEVICE WITH OPTICAL SIGNAL ENHANCEMENT STRUCTURE simplified abstract
- US Patent Application 17824922. SEMICONDUCTOR STRUCTURE OF BACKSIDE ILLUMINATION CMOS IMAGE SENSOR AND METHOD FOR FORMING THE SAME simplified abstract
- US Patent Application 18031156. OPTICAL ELEMENT, IMAGE SENSOR AND IMAGING DEVICE simplified abstract
- US Patent Application 18034233. IMAGING DEVICE simplified abstract
- US Patent Application 18224691. SOLID-STATE IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS simplified abstract
- US Patent Application 18231871. IMAGING DEVICE AND ELECTRONIC DEVICE simplified abstract
- US Patent Application 18232085. SEMICONDUCTOR ARRANGEMENT WITH ISOLATION STRUCTURE simplified abstract
- US Patent Application 18232751. Anchor Structures And Methods For Uniform Wafer Planarization And Bonding simplified abstract
- US Patent Application 18233494. Weigh Platter Assembly with Parallax Based Off-Platter Detection simplified abstract
- US Patent Application 18249356. IMAGING APPARATUS AND INFORMATION PROCESSING APPARATUS simplified abstract
- US Patent Application 18249759. LIGHT RECEIVING DEVICE simplified abstract
- US Patent Application 18318488. PHOTOELECTRIC CONVERSION DEVICE, MANUFACTURING METHOD OF PHOTOELECTRIC CONVERSION DEVICE, IMAGING SYSTEM, MOVING UNIT, AND EQUIPMENT simplified abstract
- US Patent Application 18321356. PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM, AND MOVING BODY simplified abstract
- US Patent Application 18323230. PHOTOELECTRIC CONVERSION DEVICE HAVING EXPANDED DYNAMIC RANGE AND TRANSFER ELECTRODES simplified abstract
- US Patent Application 18356058. IMAGING DEVICE simplified abstract
- US Patent Application 18357060. IMAGING ELEMENT, STACKED-TYPE IMAGING ELEMENT, AND SOLID-STATE IMAGING APPARATUS simplified abstract
- US Patent Application 18360214. METAL GRID STRUCTURE TO IMPROVE IMAGE SENSOR PERFORMANCE simplified abstract
- US Patent Application 18360601. IMAGING APPARATUS simplified abstract
- US Patent Application 18360966. METHOD FOR FORMING LIGHT PIPE STRUCTURE WITH HIGH QUANTUM EFFICIENCY simplified abstract
- US Patent Application 18362866. IMAGE SENSOR DEVICE simplified abstract
- US Patent Application 18364662. IMAGE SENSOR WITH A HIGH ABSORPTION LAYER simplified abstract
- US Patent Application 18364667. EMBEDDED LIGHT SHIELD STRUCTURE FOR CMOS IMAGE SENSOR simplified abstract
- US Patent Application 18364682. BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR simplified abstract
- US Patent Application 18364734. DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR simplified abstract