US Patent Application 18232085. SEMICONDUCTOR ARRANGEMENT WITH ISOLATION STRUCTURE simplified abstract
Contents
SEMICONDUCTOR ARRANGEMENT WITH ISOLATION STRUCTURE
Organization Name
Taiwan Semiconductor Manufacturing Company Limited
Inventor(s)
Feng-Chien Hsieh of Pingtung City (TW)
Yun-Wei Cheng of Taipei City (TW)
Kuo-Cheng Lee of Tainan City (TW)
Chen-Ming Wu of Tainan City (TW)
SEMICONDUCTOR ARRANGEMENT WITH ISOLATION STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18232085 titled 'SEMICONDUCTOR ARRANGEMENT WITH ISOLATION STRUCTURE
Simplified Explanation
The patent application describes a semiconductor arrangement with a photodiode and isolation structures.
- The photodiode is located in a substrate and extends to a certain depth from one side.
- The isolation structure surrounds the photodiode and includes a well that extends into one side of the substrate.
- A deep trench isolation is present on the other side of the substrate, and part of it is positioned underneath the first well.
Original Abstract Submitted
A semiconductor arrangement includes a photodiode extending to a first depth from a first side in a substrate. An isolation structure laterally surrounds the photodiode and includes a first well that extends into a first side of the substrate. A deep trench isolation extends into a second side of the substrate and at least a portion of the deep trench isolation underlies the first well.