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Category:H01L23/34
Subcategories
This category has the following 32 subcategories, out of 32 total.
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Pages in category "H01L23/34"
The following 73 pages are in this category, out of 73 total.
1
- 17702440. SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 17859411. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17879089. SEMICONDUCTOR PACKAGE AND THERMAL MANAGEMENT METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 17940623. FERROELECTRIC MEMORY DEVICE ERASURE simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18099366. HEATER TERMINAL CONTACTS simplified abstract (GlobalFoundries U.S. Inc.)
- 18099389. HEATER ELEMENTS simplified abstract (GlobalFoundries U.S. Inc.)
- 18133178. SEMICONDUCTOR PACKAGE AND METHOD OF PROVIDING SURFACE TEMPERATURE OF SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18156779. THERMAL SENSOR DEVICE BY BACK END OF LINE METAL RESISTOR simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18158090. Selectively Dispensed Underfill and Edge Bond Patterns simplified abstract (Apple Inc.)
- 18187444. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18265578. BONDED CONNECTION MEANS simplified abstract (Siemens Aktiengesellschaft)
- 18341381. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18397906. NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION simplified abstract (Intel Corporation)
- 18474138. TEMPERATURE SENSORS IN DIE PAIR TOPOLOGY simplified abstract (ADVANCED MICRO DEVICES, INC.)
- 18480620. MOLDED PACKAGE AND POWER MODULE WITH TEMPERATURE SENSE CAVITY (Infineon Technologies AG)
- 18499660. THERMAL APPARATUS FOR AN INTEGRATED CIRCUIT AND METHODS OF OPERATION (NXP USA, Inc.)
- 18588573. SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF PROVIDING CHIPSET simplified abstract (Renesas Electronics Corporation)
- 18588699. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18603283. NANOPARTICLE FLUOROPOLYMER ELECTRODE simplified abstract (KING FAHD UNIVERSITY OF PETROLEUM AND MINERALS)
- 18615255. SILICIDE-LAYER-COUPLED DOPED PORTION OF ACTIVE REGION AND METHOD OF FABRICATING SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18648466. SEMICONDUCTOR PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18732276. SEMICONDUCTOR DEVICE INCLUDING HEATING STRUCTURE (Samsung Electronics Co., Ltd.)
- 18743862. Integrated Circuit Apparatus And Oscillator (SEIKO EPSON CORPORATION)
- 18814715. SEMICONDUCTOR STORAGE DEVICE AND METHOD OF HEATING SEMICONDUCTOR STORAGE DEVICE (Kioxia Corporation)
- 18816494. SEMICONDUCTOR DEVICE (ROHM CO., LTD.)
- 18838369. SEMICONDUCTOR DEVICE (Mitsubishi Electric Corporation)
- 18889286. CHIP SYSTEM AND ELECTRONIC DEVICE (Huawei Technologies Co., Ltd.)
- 18894482. SEMICONDUCTOR DEVICE AND POWER CONTROL UNIT (DENSO CORPORATION)
- 18943563. COMPACT HUMIDITY AND PRESSURE SENSOR WITH TEMPERATURE CONTROL (Murata Manufacturing Co., Ltd.)
- 18945218. SEMICONDUCTOR DEVICE (ROHM CO., LTD.)
- 18974259. BIOFET WITH INCREASED SENSING AREA (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 19013244. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME (Samsung Electronics Co., Ltd.)
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- Intel corporation (20240128162). NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION simplified abstract
- Intel corporation (20240203815). LAYER TRANSFER DIODE OR THIN-FILM RESISTOR FOR GALLIUM NITRIDE (GAN) INTEGRATED CIRCUIT TECHNOLOGY simplified abstract
- Intel Corporation patent applications on April 18th, 2024
- Intel Corporation patent applications on June 20th, 2024
- INTEL CORPORATION patent applications on June 20th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on March 14th, 2024
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- Mitsubishi electric corporation (20240243030). ELECTRONIC DEVICE AND ELECTRIC POWER STEERING DEVICE simplified abstract
- Mitsubishi electric corporation (20250149528). SEMICONDUCTOR DEVICE
- Mitsubishi Electric Corporation patent applications on July 18th, 2024
- Mitsubishi Electric Corporation patent applications on May 8th, 2025
- Murata manufacturing co., ltd. (20250067713). COMPACT HUMIDITY AND PRESSURE SENSOR WITH TEMPERATURE CONTROL
- Murata Manufacturing Co., Ltd. patent applications on February 27th, 2025
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- Samsung electronics co., ltd. (20240203850). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20250149397). SEMICONDUCTOR DEVICE INCLUDING HEATING STRUCTURE
- Samsung electronics co., ltd. (20250149418). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Samsung Electronics Co., Ltd. patent applications on January 18th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 20th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 20th, 2024
- Samsung Electronics Co., Ltd. patent applications on May 8th, 2025
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- Taiwan semiconductor manufacturing co., ltd. (20240186204). METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE WITH HEATING ELEMENT simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240249991). THERMAL SENSOR DEVICE BY BACK END OF LINE METAL RESISTOR simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20250102460). BIOFET WITH INCREASED SENSING AREA
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 25th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 6th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 27th, 2025
- Taiwan semiconductor manufacturing company, ltd. (20240234526). SILICIDE-LAYER-COUPLED DOPED PORTION OF ACTIVE REGION AND METHOD OF FABRICATING SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282659). SEMICONDUCTOR PACKAGE simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 22nd, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 8th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on July 11th, 2024