18889286. CHIP SYSTEM AND ELECTRONIC DEVICE (Huawei Technologies Co., Ltd.)
CHIP SYSTEM AND ELECTRONIC DEVICE
Organization Name
Inventor(s)
Guangwei Wang of Shanghai (CN)
Xiaodong Cong of Shenzhen (CN)
CHIP SYSTEM AND ELECTRONIC DEVICE
This abstract first appeared for US patent application 18889286 titled 'CHIP SYSTEM AND ELECTRONIC DEVICE
Original Abstract Submitted
A chip system includes a BGA chip, a PCB, a signal source module, and a detection module. A function pin of the BGA chip is soldered to a function solder pad of the PCB by a first solder ball and a detection pin of the BGA chip is soldered to a detection solder pad of the PCB by a second solder ball. A designed life of the second solder ball is shorter than a designed life of the first solder ball. A detection path is formed between the BGA chip and the PCB and includes the second solder ball. The signal source module is configured to send a detection signal to the detection module through the detection path to determine a status of the detection path based on the received detection signal.
