Samsung electronics co., ltd. (20250149397). SEMICONDUCTOR DEVICE INCLUDING HEATING STRUCTURE
SEMICONDUCTOR DEVICE INCLUDING HEATING STRUCTURE
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SEMICONDUCTOR DEVICE INCLUDING HEATING STRUCTURE
This abstract first appeared for US patent application 20250149397 titled 'SEMICONDUCTOR DEVICE INCLUDING HEATING STRUCTURE
Original Abstract Submitted
a semiconductor device includes a substrate having a device region including a memory cell region and a peripheral circuit region, and a heating region surrounding the device region, a heating structure disposed in the heating region of the substrate, the heating structure surrounding the device region in a plan view, and a temperature control device electrically connected to the heating structure. the peripheral circuit region includes a peripheral gate structure. the heating structure includes a first lower structure disposed at about a same level as the peripheral gate structure. the first lower structure includes a lower dielectric layer, and a conductive layer including polysilicon disposed on the lower dielectric layer.