DENSO CORPORATION patent applications on March 27th, 2025
Patent Applications by DENSO CORPORATION on March 27th, 2025
DENSO CORPORATION: 20 patent applications
DENSO CORPORATION has applied for patents in the areas of H01L29/78 (2), H01L29/423 (2), H01L29/06 (2), H02K9/19 (2), H02K5/18 (2) H02K9/19 (2), B60H1/0073 (1), H01P3/123 (1), H10D62/106 (1), H04L41/0686 (1)
With keywords such as: power, device, control, voltage, supply, switching, section, unit, circuit, and communication in patent application abstracts.
Patent Applications by DENSO CORPORATION
Inventor(s): Ron PUTS of Wegberg DE for denso corporation, Pietro MOSCA of Wegberg DE for denso corporation
IPC Code(s): B60H1/00
CPC Code(s): B60H1/0073
Abstract: a thermal management system for an electric vehicle includes a thermal system with a control device. the control device generates lower level control outputs for operating the thermal management system based on inputs including user requests and parameters detected by a sensor device. the control device computes a cost function from the inputs to generate intermediate outputs, computes optimal control setpoints based on the intermediate outputs, and computes the lower level control outputs based on the optimal control setpoints for operating the thermal management system. the inputs are selected from a group of parameters defining target air conditions in a cabin, ambient conditions, thermal system conditions and vehicle states. the intermediate outputs comprise coefficient of performance of the thermal system and/or power consumption parameters of electric components. the optimal control setpoints comprise operating parameters of the thermal systems and/or temperature conditions.
20250102421. ROAD SURFACE FRICTION ESTIMATION DEVICE_simplified_abstract_(denso corporation)
Inventor(s): MITSUYASU ABE of Nisshin-shi JP for denso corporation
IPC Code(s): G01N19/02, B60W40/068
CPC Code(s): G01N19/02
Abstract: a road surface friction estimation device includes: a first estimation part to calculate a provisional maximum friction value based on a physical quantity in relation to friction between a road surface and a tire; a range determination part to determine a determination range of the provisional maximum friction value based on an average value and a standard deviation of the provisional maximum friction values; and a second estimation part to determine the provisional maximum friction value as an estimated maximum friction value when the provisional maximum friction value is within the determination range. the second estimation part determines a corrected value, which is a value within the determination range, as the estimated maximum friction value when the provisional maximum friction value is out of the determination range.
20250102545. SHUNT-BASED CURRENT SENSOR_simplified_abstract_(denso corporation)
Inventor(s): Shogo KAWAHARA of Nisshin-shi JP for denso corporation, Yoshikazu FURUTA of Nisshin-shi JP for denso corporation, Tomohiro NEZUKA of Nisshin-shi JP for denso corporation
IPC Code(s): G01R19/00, G01R1/20
CPC Code(s): G01R19/0007
Abstract: a shunt-based current sensor executes redundancy detection of a load current flowing through a load by using a shunt resistor. the shunt-based current sensor includes a reference resistor, a current excitation circuit, at least two voltage measurement circuits and a signal processing circuit. the reference resistor is connected to the shunt resistor in series. the current excitation circuit generates an ac excitation current and supply the ac excitation current to the shunt resistor and the reference resistor. at least two voltage measurement circuits measure a voltage across the shunt resistor. a signal processing circuit executes signal processing based on respective measurement voltages of the at least two voltage measurement circuits, and is operated in the load current redundancy detection mode or a shunt resistance measurement mode.
Inventor(s): SHOGO KAWAHARA of Nisshin-shi JP for denso corporation, YOSHIKAZU FURUTA of Nisshin-shi JP for denso corporation, TOMOHIRO NEZUKA of Nisshin-shi JP for denso corporation
IPC Code(s): G01R27/08, G01R31/374, G01R31/3835, G01R31/396
CPC Code(s): G01R27/08
Abstract: a shunt resistance measurement circuit is adapted to a shunt-based current sensor configured to measure a resistance value of a shunt resistor. the shunt resistance measurement circuit includes a control circuit, a switching power supply circuit, a voltage measurement circuit, and a signal processing circuit. the control circuit outputs a control signal including an ac carrier signal. the switching power supply circuit is operated by the control signal to output a power supply to the shunt resistor. the voltage measurement circuit measures a voltage across the shunt resistor. the signal processing circuit measures the resistance value of the shunt resistor by executing signal processing, based on the voltage measured by the voltage measurement circuit.
Inventor(s): Ryota KAMEOKA of Kariya-city JP for denso corporation, Tomohisa KISHIGAMI of Kariya-city JP for denso corporation, Tomoya TOKUNAGA of Kariya-city JP for denso corporation, Akira TADA of Kariya-city JP for denso corporation
IPC Code(s): G06F1/26, H02J1/08
CPC Code(s): G06F1/26
Abstract: a communication system includes a slave control device that receives a power supply from a power source via a first power supply switching section, a first power supply switching control section configured to receive a power supply from the power source via a second power supply switching section and control an operation of the first power supply switching section, a second power supply switching control section configured to control an operation of the second power supply switching section, a switching transmission section configured to transmit first switching instruction information indicating whether to bring the first power supply switching section into the first conduction state to the first power supply switching control section; and a power supply control section configured to bring the second power supply switching section into either the second conduction state or the second cutoff state based on the management frame.
Inventor(s): Ryota KAMEOKA of Kariya-city JP for denso corporation, Tomohisa KISHIGAMI of Kariya-city JP for denso corporation, Tomoya TOKUNAGA of Kariya-city JP for denso corporation, Akira TADA of Kariya-city JP for denso corporation
IPC Code(s): G06F1/26, G06F1/28
CPC Code(s): G06F1/263
Abstract: a communication system includes a plurality of electronic control devices connected to be capable of transmitting and receiving a communication frame. the electronic control devices includes a power supply switching device configured to receive a power supply from a power source via a power supply switching section and a management device connected to the electronic control devices to be capable of transmitting and receiving a communication frame, and is configured to control an operation of one or a plurality of power supply switching sections. at least one of the electronic control devices includes a frame generation section configured to generate a management frame that is a communication frame and a frame transmission section configured to transmit the management frame.
20250104278. SELF-POSITION ESTIMATION DEVICE_simplified_abstract_(denso corporation)
Inventor(s): Akira TOKUSE of Nisshin-shi JP for denso corporation
IPC Code(s): G06T7/73, G06T15/20, G06T17/00
CPC Code(s): G06T7/75
Abstract: a self-position estimation device is adapted to a movable object having a camera and a communication device. the camera takes an image of surrounding of the movable object. the self-position estimation device includes a feature acquisition unit, a scale calculation unit, and a self-position estimation unit. the feature acquisition unit acquires an image feature point. the scale calculation unit calculates an actual scale of the image. the self-position estimation unit estimates a self-position of the movable object based on the image feature point and the actual scale. the scale calculation unit acquires object information and an object image feature point, and calculates the actual scale based on the acquired object information and a feature value of the acquired object image feature point.
20250105081. SEMICONDUCTOR DEVICE AND POWER CONTROL UNIT_simplified_abstract_(denso corporation)
Inventor(s): Keita FUKUTANI of Kariya-city JP for denso corporation, Masanori MIYATA of Kariya-city JP for denso corporation
IPC Code(s): H01L23/34, G01K3/00, H01L23/00, H01L23/31, H01L23/473
CPC Code(s): H01L23/34
Abstract: a semiconductor device includes: a semiconductor substrate having an active region and an outer peripheral region in which a voltage withstanding structure is formed to surround the active region; a temperature sensor configured to detect a temperature of the semiconductor substrate in the outer peripheral region; and a conductive spacer disposed on the active region. the temperature sensor is positioned not to overlap the conductive spacer in the thickness direction. the temperature sensor is positioned closer to a center of the semiconductor substrate in an orthogonal direction perpendicular to the thickness direction than the voltage withstanding structure is.
20250105484. WAVEGUIDE_simplified_abstract_(denso corporation)
Inventor(s): Masakazu IKEDA of Nisshin-city JP for denso corporation, Takahiro KATO of Nisshin-shi JP for denso corporation
IPC Code(s): H01P3/123, H01Q1/38, H01Q21/06
CPC Code(s): H01P3/123
Abstract: a waveguide includes a first waveguide having a first waveguide hole and a second waveguide having a second waveguide hole and assembled to the first waveguide with a predetermined gap therebetween. the second waveguide hole has an opening on one surface of the second waveguide facing the first waveguide, and the opening has a rounded polygonal shape or a circular shape. the second waveguide includes a resin molded product and a metal coating film covering the resin molded product, and the second waveguide has a choke groove around the second waveguide hole. the choke groove has such a shape that a length between a wall surface of the second waveguide hole and an inner wall surface of the choke groove adjacent to the second waveguide hole is constant along a circumferential direction of the second waveguide hole.
Inventor(s): Masaya TAKAHASHI of Kariya-city JP for denso corporation, Yusei NAKAYASHIKI of Kariya-city JP for denso corporation, Mitsuru SHIBANUMA of Kariya-city JP for denso corporation, Nobuhisa YAMAGUCHI of Kariya-city JP for denso corporation
IPC Code(s): H02J50/12, H02J50/70
CPC Code(s): H02J50/12
Abstract: a power output circuit includes a plurality of circuit blocks that are provided in power wirings to which power is inputted and connected to each other side by side. each of the plurality of circuit blocks includes at least a filter in a last post-stage. each of the plurality of filters includes a reactor and a capacitor connected to the reactor at a node differing from an output node. either of the reactor and the capacitor provided in each of the plurality of filters is connected to the power wirings in series so as to connect with the output node. a connection line between the reactor and the capacitor in one filter is connected to a connection line between the reactor and the capacitor in the remaining other filter.
20250105703. DRIVE DEVICE_simplified_abstract_(denso corporation)
Inventor(s): Shohei NAGAI of Kariya-city JP for denso corporation, Jiro HAYASHI of Kariya-city JP for denso corporation
IPC Code(s): H02K9/19, H02K5/18, H02K5/20, H02K7/08, H02K9/06, H02K11/33
CPC Code(s): H02K9/19
Abstract: an epu includes a motor device, an inverter device, a unit housing, and a cooling device. the motor device includes a motor and a motor housing. the inverter device includes an inverter and an inverter housing. the motor and the inverter are accommodated in the unit housing. the cooling device includes a refrigerant passage and a refrigerant pump. the refrigerant pump causes a refrigerant to flow so as to circulate through the refrigerant passage. the refrigerant flowing through the refrigerant passage cools both the motor device and the inverter device.
20250105704. DRIVE DEVICE_simplified_abstract_(denso corporation)
Inventor(s): Shohei Nagai of Kariya-city JP for denso corporation, Jiro Hayashi of Kariya-city JP for denso corporation
IPC Code(s): H02K9/19, H02K5/18, H02K5/20, H02K9/06, H02K11/33
CPC Code(s): H02K9/19
Abstract: an epu includes a motor device, an inverter device, a unit housing, and a cooling device. the motor device includes a motor and a motor housing. the inverter device includes an inverter and an inverter housing. the motor and the inverter are accommodated in the unit housing. the cooling device includes a refrigerant passage and a refrigerant pump. the refrigerant pump causes the refrigerant to flow to circulate through the refrigerant passage. the unit housing includes a refrigerant fin to dissipate heat of the refrigerant to an outside. the refrigerant fin is provided on a unit outer surface.
20250105750. POWER CONVERSION DEVICE_simplified_abstract_(denso corporation)
Inventor(s): Kazuma SUZUKI of Nisshin-city JP for denso corporation, Shunichi KUBO of Kariya-city JP for denso corporation
IPC Code(s): H02M3/335, H02M1/32, H02M3/00
CPC Code(s): H02M3/33569
Abstract: a power conversion device includes low voltage terminals and high voltage terminals. the power conversion device includes: a voltage increasing operation unit increasing the voltage input to the low voltage terminals and outputting the increased voltage to the high voltage terminals, a voltage decreasing operation unit decreasing the voltage input to the high voltage terminals and outputting the decreased voltage to the low voltage terminals, and a control unit performing a temperature increasing operation to increase a temperature of a temperature increasing object, by causing the voltage increasing operation unit to perform a voltage increasing operation and the voltage decreasing operation unit to perform a voltage decreasing operation.
20250106001. REMOTE ATTESTATION WITH REMEDIATION_simplified_abstract_(denso corporation)
Inventor(s): Ameer Kashani of Southfield MI US for denso corporation, Carlos Mora-Golding of Southfield MI US for denso corporation, Yasuharu Sugano of Kariya, Aichi JP for denso corporation, Tomonori Ikuse of Kariya, Aichi JP for denso corporation, Madoka Asai of Kariya, Aichi JP for denso corporation
IPC Code(s): H04L9/00, H04L9/32
CPC Code(s): H04L9/008
Abstract: systems, methods, and other embodiments described herein relate to remote attestation using a homomorphic hash. in one embodiment, a method includes identifying software components and associated metrics of the software components executing within a computing system of a vehicle according to a policy. the method includes constructing a tree according to the software components and partitions within the software components. the method includes storing, in leaf nodes of the tree, measurements of the metrics. the parent nodes define a hierarchical relationship between software components and the partitions. the method includes generating an incremental hash of the tree. the method includes providing the incremental hash as a secure representation of the software components.
20250106065. COMMUNICATION SYSTEM_simplified_abstract_(denso corporation)
Inventor(s): Ryota KAMEOKA of Kariya-city JP for denso corporation, Tomohisa KISHIGAMI of Kariya-city JP for denso corporation, Tomoya TOKUNAGA of Kariya-city JP for denso corporation, Akira TADA of Kariya-city JP for denso corporation
IPC Code(s): H04L12/40, G06F1/3296, G07C5/08
CPC Code(s): H04L12/40039
Abstract: a communication system includes a first control device that receives a power supply from a power source via a power supply switching section configured to switch between a conduction state and a cutoff state and a second control device that is data-communicably connected to the first control device and controls an operation of the power supply switching section. the second control device includes a state confirmation section that determines whether the first control device is in a cutoff-allowable state and a power supply control section that brings the power supply switching section into the cutoff state when the state confirmation section determines that the first control device is in the cutoff-allowable state.
20250106098. COMMUNICATION SYSTEM_simplified_abstract_(denso corporation)
Inventor(s): Manahiro MORITA of Kariya-city JP for denso corporation, Tomohisa KISHIGAMI of Kariya-city JP for denso corporation, Taku INAGAWA of Kariya-city JP for denso corporation
IPC Code(s): H04L41/0686, G07C5/08, H04L12/40, H04L12/407, H04L41/0681
CPC Code(s): H04L41/0686
Abstract: a communication system includes a plurality of communication nodes that relay fault diagnosis communication of a diagnosis request and q diagnosis result between a request source and a request destination of the fault diagnosis. a communication setting unit of one of the communication nodes increases a priority of a priority parameter indicating the priority of communication when a communication determination unit determines that the present communication is the fault diagnosis communication either when transmitting the diagnosis request or when transmitting the diagnosis result.
Inventor(s): Hidefumi TAKAYA of Toyota-shi JP for denso corporation, Yuichi TAKEUCHI of Kariya-city JP for denso corporation, Yukihiko WATANABE of Nagakute-shi JP for denso corporation
IPC Code(s): H01L29/06, H01L29/423, H01L29/66, H01L29/78
CPC Code(s): H10D62/106
Abstract: a semiconductor device includes a semiconductor substrate having an element region and a terminal region located around the element region. the terminal region includes multiple guard rings and multiple first diffusion regions. when the semiconductor substrate is viewed in a plan view, one of the first diffusion regions is arranged correspondingly to one of the guard rings, and each of the guard rings is located in corresponding one of the first diffusion regions. a width of each of the first diffusion regions is larger than a width of corresponding one of the guard rings.
20250107187. SWITCHING ELEMENT_simplified_abstract_(denso corporation)
Inventor(s): Jun SAITO of Nisshin-shi JP for denso corporation
IPC Code(s): H01L29/08, H01L29/06, H01L29/423, H01L29/78
CPC Code(s): H10D62/155
Abstract: a switching element includes a gate electrode and a source electrode disposed in each of trenches provided in a semiconductor substrate. a longitudinal direction of the trench is defined as a first direction, and the trenches are spaced from each other in a second direction intersecting the first direction. each of the trenches extends in the first direction while being displaced in the second direction so as to satisfy that an inter-trench region between the adjacent trenches has narrow portions and wide portions alternately arranged in the first direction and alternately arranged in the second direction via the trenches. a source region is distributed across the narrow portion and the wide portion, and is in contact with the source electrode in the wide portion.
- DENSO CORPORATION
- B60H1/00
- CPC B60H1/0073
- Denso corporation
- G01N19/02
- B60W40/068
- CPC G01N19/02
- G01R19/00
- G01R1/20
- CPC G01R19/0007
- G01R27/08
- G01R31/374
- G01R31/3835
- G01R31/396
- CPC G01R27/08
- G06F1/26
- H02J1/08
- CPC G06F1/26
- G06F1/28
- CPC G06F1/263
- G06T7/73
- G06T15/20
- G06T17/00
- CPC G06T7/75
- H01L23/34
- G01K3/00
- H01L23/00
- H01L23/31
- H01L23/473
- CPC H01L23/34
- H01P3/123
- H01Q1/38
- H01Q21/06
- CPC H01P3/123
- H02J50/12
- H02J50/70
- CPC H02J50/12
- H02K9/19
- H02K5/18
- H02K5/20
- H02K7/08
- H02K9/06
- H02K11/33
- CPC H02K9/19
- H02M3/335
- H02M1/32
- H02M3/00
- CPC H02M3/33569
- H04L9/00
- H04L9/32
- CPC H04L9/008
- H04L12/40
- G06F1/3296
- G07C5/08
- CPC H04L12/40039
- H04L41/0686
- H04L12/407
- H04L41/0681
- CPC H04L41/0686
- H01L29/06
- H01L29/423
- H01L29/66
- H01L29/78
- CPC H10D62/106
- H01L29/08
- CPC H10D62/155
