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Category:Thorsten Scharf of Lappersdorf DE

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Thorsten Scharf

Thorsten Scharf from Lappersdorf DE has applied for patents in technology areas such as H01L23/34, H01L23/053, H01L23/31 with Infineon Technologies AG.

Patents

MOLDED PACKAGE AND POWER MODULE WITH TEMPERATURE SENSE CAVITY (18480620)

Pages in category "Thorsten Scharf of Lappersdorf DE"

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1

18480620. MOLDED PACKAGE AND POWER MODULE WITH TEMPERATURE SENSE CAVITY (Infineon Technologies AG)

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