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Category:G06F30/3953
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This category has the following 33 subcategories, out of 33 total.
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Pages in category "G06F30/3953"
The following 52 pages are in this category, out of 52 total.
1
- 17542882. THREE-DIMENSIONAL ROUGHNESS EXTRACTION OF METAL simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17863382. ZERO DIFFUSION BREAK simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18155536. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18167421. INTEGRATED CIRCUIT INCLUDING STANDARD CELLS, METHOD OF MANUFACTURING THE INTEGRATED CIRCUIT, AND COMPUTING SYSTEM FOR PERFORMING THE METHOD simplified abstract (Samsung Electronics Co., Ltd.)
- 18342042. EQUIVALENT WIRE CODES FOR ROUTING NETS IN AN INTEGRATED CIRCUIT DESIGN (International Business Machines Corporation)
- 18344788. YIELDING AND ROUTABLE CIRCUIT CO-DESIGN USING VIABARS (International Business Machines Corporation)
- 18362842. PIN ACCESS HYBRID CELL HEIGHT DESIGN AND SYSTEM simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18418425. SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING AND DESIGNING (NXP B.V.)
- 18448155. INTEGRATED CIRCUIT LAYOUT METHOD simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18552213. PRINTED CIRCUIT BOARD PIN FIELD SIGNAL ROUTING simplified abstract (Intel Corporation)
- 18610905. NETWORK CREDIT RETURN MECHANISMS simplified abstract (Micron Technology, Inc.)
- 18631815. COMPUTING SYSTEM AND INTEGRATED CIRCUIT DESIGN SYSTEM USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18641386. SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18668922. BUMP JOINT STRUCTURE WITH DISTORTION AND METHOD FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18670009. INTEGRATED CIRCUIT INCLUDING STANDARD CELL AND METHOD OF MANUFACTURING THE INTEGRATED CIRCUIT simplified abstract (Samsung Electronics Co., Ltd.)
- 18824006. ROUTING METHOD AND SYSTEM (SAMSUNG ELECTRONICS CO., LTD.)
- 18982045. Multiple Power Domains Using Nano-sheet Structures (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18982158. METHOD OF FABRICATING SEMICONDUCTOR DEVICE INCLUDING STANDARD-CELL-ADAPTED POWER GRID ARRANGEMENT (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 19018736. VIA RAIL STRUCTURE (Taiwan Semiconductor Manufacturing Company, Ltd.)
I
- Intel corporation (20240176941). PRINTED CIRCUIT BOARD PIN FIELD SIGNAL ROUTING simplified abstract
- Intel Corporation patent applications on May 30th, 2024
- International business machines corporation (20250005251). EQUIVALENT WIRE CODES FOR ROUTING NETS IN AN INTEGRATED CIRCUIT DESIGN
- International business machines corporation (20250005252). YIELDING AND ROUTABLE CIRCUIT CO-DESIGN USING VIABARS
- International Business Machines Corporation patent applications on January 2nd, 2025
M
S
- Samsung electronics co., ltd. (20240265188). SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240303410). INTEGRATED CIRCUIT INCLUDING STANDARD CELL AND METHOD OF MANUFACTURING THE INTEGRATED CIRCUIT simplified abstract
- Samsung electronics co., ltd. (20240419884). COMPUTING SYSTEM AND INTEGRATED CIRCUIT DESIGN SYSTEM USING THE SAME
- Samsung electronics co., ltd. (20250061262). METHOD OF DESIGNING INTERCONNECT STRUCTURE OF SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS USING THE SAME
- Samsung electronics co., ltd. (20250103787). ROUTING METHOD AND SYSTEM
- Samsung Electronics Co., Ltd. patent applications on August 8th, 2024
- Samsung Electronics Co., Ltd. patent applications on December 19th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 19th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 20th, 2025
- Samsung Electronics Co., Ltd. patent applications on March 27th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 27th, 2025
- Samsung Electronics Co., Ltd. patent applications on September 12th, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20240330564). SEMICONDUCOTR DEVICE HAVING POWER RAIL WITH NON-LINEAR EDGE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20250117563). Multiple Power Domains Using Nano-sheet Structures
- Taiwan semiconductor manufacturing co., ltd. (20250117564). METHOD OF FABRICATING SEMICONDUCTOR DEVICE INCLUDING STANDARD-CELL-ADAPTED POWER GRID ARRANGEMENT
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on April 10th, 2025
- Taiwan semiconductor manufacturing company, ltd. (20240304533). BUMP JOINT STRUCTURE WITH DISTORTION AND METHOD FORMING SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379543). SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250005255). INTEGRATED CIRCUIT DESIGN SYSTEM, METHOD AND COMPUTER PROGRAM PRODUCT
- Taiwan semiconductor manufacturing company, ltd. (20250149439). VIA RAIL STRUCTURE
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on January 2nd, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 8th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 12th, 2024