19018736. VIA RAIL STRUCTURE (Taiwan Semiconductor Manufacturing Company, Ltd.)
VIA RAIL STRUCTURE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Tung-Heng Hsieh of Hsinchu County TW
Sheng-Hsiung Wang of Hsinchu County TW
Bao-Ru Young of Hsinchu County TW
Wang-Jung Hsueh of New Taipei City TW
VIA RAIL STRUCTURE
This abstract first appeared for US patent application 19018736 titled 'VIA RAIL STRUCTURE
Original Abstract Submitted
A device includes a semiconductor substrate, an active region over the semiconductor substrate extending lengthwise in a first direction, a gate structure over the active region extending lengthwise in a second direction perpendicular to the first direction, a source feature and a drain feature on the active region and interposed by the gate structure, a source contact on the source feature, a drain contact on the drain feature, and a via rail over the substrate spaced from the active region. The via rail includes a main portion extending lengthwise in the first direction having a sidewall surface facing opposite the end surface of the drain contact, and a jog via extending from the main portion along the second direction and having a sidewall surface facing the second direction, each of the main portion and the jog via contacting the source contact.