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Category:CPC H01L24/17
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Pages in category "CPC H01L24/17"
The following 66 pages are in this category, out of 66 total.
1
- 18436643. Honeycomb Pattern for Conductive Features simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18738727. SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE (ROHM CO., LTD.)
- 18814696. UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18830785. SEMICONDUCTOR PACKAGE (Samsung Electronics Co., Ltd.)
- 18969889. MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM) (Intel Corporation)
- 18976931. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18983612. HONEYCOMB PATTERN FOR CONDUCTIVE FEATURES (Taiwan Semiconductor Manufacturing Co., Ltd.)
A
- Adeia Semiconductor Bonding Technologies Inc. Patent Application Trends in 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. Patent Application Trends in 2024
- Advanced Semiconductor Engineering, Inc. Patent Application Trends in 2025
- Amkor Technology Singapore Holding Pte. Ltd. Patent Application Trends in 2025
- Apple Inc Patent Application Trends in 2025
- Apple Inc. Patent Application Trends in 2025
- APPLE INC. Patent Application Trends in 2025
F
I
- Innolux Corporation Patent Application Trends in 2024
- Intel corporation (20250096178). MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM)
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation Patent Application Trends in 2025
- Intel Corporation patent applications on March 20th, 2025
- INTERNATIONAL BUSINESS MACHINES CORPORATION (20240421113). UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS
- International business machines corporation (20240421113). UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS
- International Business Machines Corporation Patent Application Trends in 2025
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on December 19th, 2024
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Q
R
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- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20250112193). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250149490). SEMICONDUCTOR PACKAGE
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on April 3rd, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 3rd, 2025
- Samsung Electronics Co., Ltd. patent applications on May 8th, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation Patent Application Trends in 2025
- SILICONWARE PRECISION INDUSTRIES CO., LTD. Patent Application Trends in 2024
- SKYWORKS SOLUTIONS, INC. Patent Application Trends in 2024
- Skyworks Solutions, Inc. Patent Application Trends in 2025
- SKYWORKS SOLUTIONS, INC. Patent Application Trends in 2025
T
- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan semiconductor manufacturing co., ltd. (20250118694). HONEYCOMB PATTERN FOR CONDUCTIVE FEATURES
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on April 10th, 2025
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025