UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Eric Peter Lewandowski of White Plains NY (US)

Dongbing Shao of Briarcliff Manor NY (US)

UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS

This abstract first appeared for US patent application 20240421113 titled 'UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS

Original Abstract Submitted

systems and techniques that facilitate uniform qubit chip gaps via injection-molded solder pillars are provided. in various embodiments, a device can comprise one or more injection-molded solder interconnects. in various aspects, the one or more injection-molded solder interconnects can couple at least one qubit chip to an interposer chip. in various embodiments, the device can further comprise one or more injection-molded solder pillars. in various instances, the one or more injection-molded solder pillars can be between the at least one quit chip and the interposer chip. in various cases, the one or more injection-molded solder pillars can be in parallel with the one or more injection-molded solder interconnects. in various embodiments, the one or more injection-molded solder pillars can facilitate and/or maintain a uniform gap between the at least one qubit chip and the interposer chip. in various embodiments, a melting point of the one or more injection-molded solder pillars can be higher than a melting point of the one or more injection-molded solder interconnects. in various embodiments, the one or more injection-molded solder pillars can be superconductors. in various embodiments, a yield strength of the one or more injection-molded solder pillars can be between 3,000 pounds per square inch and 15,000 pounds per square inch, which can be higher than a yield strength of the one or more injection-molded solder interconnects. in various embodiments, the one or more injection-molded solder pillars can be binary tin alloys, tertiary tin alloys, and/or quaternary tin alloys.