Taiwan semiconductor manufacturing co., ltd. (20250118694). HONEYCOMB PATTERN FOR CONDUCTIVE FEATURES
HONEYCOMB PATTERN FOR CONDUCTIVE FEATURES
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Shenggao Li of Cupertino CA US
HONEYCOMB PATTERN FOR CONDUCTIVE FEATURES
This abstract first appeared for US patent application 20250118694 titled 'HONEYCOMB PATTERN FOR CONDUCTIVE FEATURES
Original Abstract Submitted
a method includes forming a first package component, and forming a first plurality of electrical connectors at a first surface of the first package component. the first plurality of electrical connectors are laid out as having a honeycomb pattern. a second package component is bonded to the first package component, wherein a second plurality of electrical connectors at a second surface of the second package component are bonded to the first plurality of electrical connectors.