18976931. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Seokhyun Lee of Hwaseong-si KR
SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 18976931 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
A semiconductor package includes a base substrate; a redistribution substrate disposed on the base substrate, and that includes first insulating layers and redistribution pattern layers disposed on the first insulating layers, respectively; a semiconductor chip disposed on the redistribution substrate and electrically connected to the redistribution pattern layers; and a chip structure disposed on the redistribution substrate adjacent to the semiconductor chip and electrically connected to the semiconductor chip through the redistribution pattern layers, wherein the semiconductor chip includes a body that has an active surface that faces the redistribution substrate; first and second contact pads spaced apart from each other below the active surface; a first bump structure and a passive device electrically connected to the first connection pad at a lower level from the first connection pad; and a second bump structure electrically connected to the second connection pad at a lower level from the second connection pad.