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Category:CPC H01L23/49894
Pages in category "CPC H01L23/49894"
The following 85 pages are in this category, out of 85 total.
1
- 18005745. Dielectric Material Layer, Surface Treatment Method, Package Substrate, and Electronic Device simplified abstract (Honor Device Co., Ltd.)
- 18089801. GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES simplified abstract (Intel Corporation)
- 18092012. GLASS SUBSTRATES WITH SELF-ASSEMBLED MONOLAYERS FOR COPPER ADHESION simplified abstract (Intel Corporation)
- 18147535. METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE INTEGRATED CIRCUIT PACKAGES HAVING SILICON NITRIDE ADHESION PROMOTERS simplified abstract (Intel Corporation)
- 18155398. INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A RE-DISTRIBUTION LAYER (RDL) SUBSTRATE(S) WITH PHOTOSENSITIVE DIELECTRIC LAYER(S) FOR INCREASED PACKAGE RIGIDITY, AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 18217056. FORMING POROUS DIELECTRIC STRUCTURES WITH SPATIALLY-CONTROLLED POROSITY (Intel Corporation)
- 18373095. POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES (Intel Corporation)
- 18476561. INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE HAVING THERMAL ISOMERIC MOIETIES AND NON-THERMAL ISOMERIC MOIETIES (INTEL CORPORATION)
- 18481872. SEMICONDUCTOR PACKAGE, AND REDISTRIBUTION SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 18523970. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18524454. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18648599. PACKAGE SUBSTRATE HAVING POROUS DIELECTRIC LAYER simplified abstract (Texas Instruments Incorporated)
- 18659703. SEMICONDUCTOR PACKAGE (Samsung Electronics Co., Ltd.)
- 18828196. SEMICONDUCTOR PACKAGE INCLUDING INSULATING MATERIAL (SAMSUNG ELECTRONICS CO., LTD.)
2
A
- Advanced micro devices Patent Application Trends in 2024
- Amkor Technology Singapore Holding Pte. Ltd. Patent Application Trends in 2025
- Apple Patent Application Trends in 2024
- Asahi Kasei Kabushiki Kaisha Patent Application Trends in 2024
- Avago Technologies International Sales Pte. Limited Patent Application Trends in 2025
F
H
I
- Industrial Technology Research Institute Patent Application Trends in 2024
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE Patent Application Trends in 2024
- InnoLux Corporation Patent Application Trends in 2025
- Intel corporation (20240222257). GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES simplified abstract
- Intel corporation (20240222258). GLASS SUBSTRATES WITH SELF-ASSEMBLED MONOLAYERS FOR COPPER ADHESION simplified abstract
- Intel corporation (20240222259). METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE INTEGRATED CIRCUIT PACKAGES HAVING SILICON NITRIDE ADHESION PROMOTERS simplified abstract
- Intel corporation (20250006623). FORMING POROUS DIELECTRIC STRUCTURES WITH SPATIALLY-CONTROLLED POROSITY
- Intel corporation (20250105132). POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES
- Intel corporation (20250112144). INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE HAVING THERMAL ISOMERIC MOIETIES AND NON-THERMAL ISOMERIC MOIETIES
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation Patent Application Trends in 2025
- Intel Corporation patent applications on April 3rd, 2025
- INTEL CORPORATION patent applications on April 3rd, 2025
- Intel Corporation patent applications on January 2nd, 2025
- Intel Corporation patent applications on July 4th, 2024
- Intel Corporation patent applications on March 27th, 2025
- International Business Machines Corporation Patent Application Trends in 2025
L
M
Q
- Qualcomm incorporated (20240243056). INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A RE-DISTRIBUTION LAYER (RDL) SUBSTRATE(S) WITH PHOTOSENSITIVE DIELECTRIC LAYER(S) FOR INCREASED PACKAGE RIGIDITY, AND RELATED FABRICATION METHODS simplified abstract
- Qualcomm Incorporated Patent Application Trends in 2024
- QUALCOMM INCORPORATED Patent Application Trends in 2024
- Qualcomm Incorporated Patent Application Trends in 2025
- Qualcomm incorporated Patent Application Trends in 2025
- QUALCOMM Incorporated patent applications on July 18th, 2024
S
- SAMSUNG ELECTRO-MECHANICS CO., LTD. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240194582). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240213138). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240321722). SEMICONDUCTOR PACKAGE, AND REDISTRIBUTION SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- Samsung electronics co., ltd. (20250105133). SEMICONDUCTOR PACKAGE INCLUDING INSULATING MATERIAL
- Samsung electronics co., ltd. (20250132243). SEMICONDUCTOR PACKAGE
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on April 24th, 2025
- Samsung Electronics Co., Ltd. patent applications on January 30th, 2025
- Samsung Electronics Co., Ltd. patent applications on June 13th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 13th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 27th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 27th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 27th, 2025
- Samsung Electronics Co., Ltd. patent applications on September 26th, 2024
- Skyworks Solutions, Inc. Patent Application Trends in 2025
- SKYWORKS SOLUTIONS, INC. Patent Application Trends in 2025
T
- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Texas instruments incorporated (20240282693). PACKAGE SUBSTRATE HAVING POROUS DIELECTRIC LAYER simplified abstract
- Texas Instruments Incorporated patent applications on August 22nd, 2024
- TOPPAN Holdings Inc. Patent Application Trends in 2025