FLAT PACKAGE

Abstract: a flat package includes a die, a cover layer, multiple conductive contacts, and a dielectric protection layer. the cover layer includes a molding layer. the molding layer covers the die yet exposes multiple pads on the die. the conductive contacts are formed on a surface of a molding layer facing a same side as the pads, and the conductive contacts are electrically connected to the pads respectively. the dielectric protection layer partially covers surfaces of the conductive contacts and of the molding layer. the flat package can be easily manufactured, as manufacturing the flat package consumes little time and cost. the flat package is small in its overall size, allowing the flat package to fit into a product for use.

Inventor(s): YUNG-HUI WANG, CHUNG-HSIUNG HO, WEI-TING CHEN

CPC Classification: H01L23/49894 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate )})

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