There is currently no text in this page. You can search for this page title in other pages, or search the related logs, but you do not have permission to create this page.
Category:CPC H01L23/427
Pages in category "CPC H01L23/427"
The following 68 pages are in this category, out of 68 total.
1
- 18144691. POWER MODULE simplified abstract (HYUNDAI MOTOR COMPANY)
- 18144691. POWER MODULE simplified abstract (KIA CORPORATION)
- 18149617. MIXED PHASE THERMAL INTERFACE MATERIAL ASSEMBLY WITH HIGH THERMAL CONDUCTIVITY AND LOW INTERNAL CONTACT RESISTANCE simplified abstract (NVIDIA Corporation)
- 18202613. SEMICONDUCTOR DEVICE HAVING TWO-PHASE COOLING STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18216830. PASSIVE COOLING HEAT SPREADER WITH PHASE CHANGE MATERIAL INFUSED MESH (Intel Corporation)
- 18379133. INVERTED MEMORY STACK (Advanced Micro Devices, Inc.)
- 18410761. HEAT RADIATION DEVICES (SAMSUNG ELECTRONICS CO., LTD.)
- 18418559. HEAT TRANSPORT DEVICE AND SEMICONDUCTOR MODULE simplified abstract (DENSO CORPORATION)
- 18418559. HEAT TRANSPORT DEVICE AND SEMICONDUCTOR MODULE simplified abstract (TOYOTA JIDOSHA KABUSHIKI KAISHA)
- 18422392. HEAT DISSIPATION BY NANO PIPES (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18505412. HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18514514. SEMICONDUCTOR DEVICE WITH 2-PHASE COOLING STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 18616721. COOLING STRUCTURE AND METHOD FOR SEMICONDUCTOR DEVICE (SAMSUNG ELECTRONICS CO., LTD.)
- 18728617. HYBRID HEAT SINK (Siemens Aktiengesellschaft)
2
A
- Adeia Semiconductor Bonding Technologies Inc. Patent Application Trends in 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. Patent Application Trends in 2024
- ADVANTEST CORPORATION Patent Application Trends in 2024
- Apple Inc Patent Application Trends in 2025
- Apple Inc. Patent Application Trends in 2025
- APPLE INC. Patent Application Trends in 2025
- Arista Networks, Inc. Patent Application Trends in 2025
D
I
- Industrial Technology Research Institute Patent Application Trends in 2024
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE Patent Application Trends in 2024
- Intel corporation (20250006588). PASSIVE COOLING HEAT SPREADER WITH PHASE CHANGE MATERIAL INFUSED MESH
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation Patent Application Trends in 2025
- Intel Corporation patent applications on January 2nd, 2025
M
N
- Nokia Patent Application Trends in 2024
- Nokia Technologies Oy Patent Application Trends in 2024
- Nvidia corporation (20240222221). MIXED PHASE THERMAL INTERFACE MATERIAL ASSEMBLY WITH HIGH THERMAL CONDUCTIVITY AND LOW INTERNAL CONTACT RESISTANCE simplified abstract
- NVIDIA Corporation Patent Application Trends in 2024
- NVIDIA Corporation patent applications on July 4th, 2024
- Nvidia Patent Application Trends in 2024
S
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240203821). SEMICONDUCTOR DEVICE HAVING TWO-PHASE COOLING STRUCTURE simplified abstract
- Samsung electronics co., ltd. (20240321679). HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240321680). SEMICONDUCTOR DEVICE WITH 2-PHASE COOLING STRUCTURE simplified abstract
- Samsung electronics co., ltd. (20240413053). HEAT RADIATION DEVICES
- Samsung electronics co., ltd. (20250105093). COOLING STRUCTURE AND METHOD FOR SEMICONDUCTOR DEVICE
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on December 12th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 12th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 20th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 20th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 27th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 27th, 2025
- Samsung Electronics Co., Ltd. patent applications on September 26th, 2024
T
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20250140644). HEAT DISSIPATION BY NANO PIPES
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 1st, 2025
- The Regents of the University of Colorado, a Body Corporate Patent Application Trends in 2024