PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE

Abstract: some embodiments relate to an integrated device, including a substrate having at least one active component; an interconnect structure disposed on the substrate; a bonding layer disposed over the interconnect structure; a carrier substrate disposed over the bonding structure; a heat dissipating module disposed over the carrier substrate; and a first thermal control layer disposed between the carrier substrate and the heat dissipating module, the bonding layer and the interconnect structure, or the carrier substrate and the bonding layer, wherein the first thermal control layer comprises a phase change material (pcm).

Inventor(s): Sam Vaziri, Isha Datye, Xinyu Bao

CPC Classification: H01L23/427 (Cooling by change of state, e.g. use of heat pipes {(by liquefied gas )})

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