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Category:CPC H01L23/13
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Pages in category "CPC H01L23/13"
The following 92 pages are in this category, out of 92 total.
1
- 18091349. PACKAGE SUBSTRATE HAVING DEPRESSION simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18394750. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18456295. PACKAGE COMPRISING A SUBSTRATE WITH AN EMBEDDED FRAME (QUALCOMM Incorporated)
- 18471069. PACKAGE COMPRISING A SUBSTRATE WITH CAVITY, AND AN INTEGRATED DEVICE LOCATED IN THE CAVITY OF THE SUBSTRATE (QUALCOMM Incorporated)
- 18517980. SUBSTRATES FOR SEMICONDUCTOR PACKAGES simplified abstract (Micron Technology, Inc.)
- 18570678. SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18658546. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18754605. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18756679. METHODS AND APPARATUS TO REDUCE DELAMINATION IN HYBRID CORES simplified abstract (Intel Corporation)
- 18764401. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME (Samsung Electronics Co., Ltd.)
- 18804501. SEMICONDUCTOR PACKAGE (Samsung Electronics Co., Ltd.)
- 18928536. SEMICONDUCTOR DEVICE (DENSO CORPORATION)
A
D
I
- Industrial Technology Research Institute Patent Application Trends in 2024
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE Patent Application Trends in 2024
- Industrial Technology Research Institute Patent Application Trends in 2025
- Intel corporation (20240347402). METHODS AND APPARATUS TO REDUCE DELAMINATION IN HYBRID CORES simplified abstract
- Intel corporation (20240404896). PATCH INTERPOSER MOLD DESIGN FOR LIQUID METAL CARRIER ARRAY
- Intel corporation (20240404896). PATCH INTERPOSER MOLD DESIGN FOR LIQUID METAL CARRIER ARRAY simplified abstract
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation Patent Application Trends in 2025
- Intel Corporation patent applications on December 5th, 2024
- Intel Corporation patent applications on October 17th, 2024
K
L
M
- MEDIATEK Inc. Patent Application Trends in 2024
- MEDIATEK INC. Patent Application Trends in 2024
- Micron technology, inc. (20240194547). SUBSTRATES FOR SEMICONDUCTOR PACKAGES simplified abstract
- Micron technology, inc. (20240203804). ENGINEERED SEMICONDUCTOR SUBSTRATE simplified abstract
- Micron Technology, Inc. Patent Application Trends in 2024
- Micron Technology, Inc. patent applications on June 13th, 2024
- Micron Technology, Inc. patent applications on June 20th, 2024
- Mitsubishi electric corporation (20240282650). SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi Electric Corporation Patent Application Trends in 2024
- MITSUBISHI ELECTRIC CORPORATION Patent Application Trends in 2024
- Mitsubishi Electric Corporation patent applications on August 22nd, 2024
Q
- Qualcomm incorporated (20250069965). PACKAGE COMPRISING A SUBSTRATE WITH AN EMBEDDED FRAME
- Qualcomm incorporated (20250096051). PACKAGE COMPRISING A SUBSTRATE WITH CAVITY, AND AN INTEGRATED DEVICE LOCATED IN THE CAVITY OF THE SUBSTRATE
- Qualcomm Incorporated Patent Application Trends in 2024
- QUALCOMM INCORPORATED Patent Application Trends in 2024
- Qualcomm Incorporated Patent Application Trends in 2025
- QUALCOMM Incorporated patent applications on February 27th, 2025
- QUALCOMM Incorporated patent applications on March 20th, 2025
R
S
- Samsung Display Co., LTD Patent Application Trends in 2024
- SAMSUNG DISPLAY CO., LTD. Patent Application Trends in 2024
- Samsung Display Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240347401). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240413026). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250006567). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250014953). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Samsung electronics co., ltd. (20250062167). SEMICONDUCTOR PACKAGES INCLUDING DAM STRUCTURES
- Samsung electronics co., ltd. (20250087541). SEMICONDUCTOR PACKAGE
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on December 12th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 12th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 20th, 2025
- Samsung Electronics Co., Ltd. patent applications on January 2nd, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 2nd, 2025
- Samsung Electronics Co., Ltd. patent applications on January 9th, 2025
- Samsung Electronics Co., Ltd. patent applications on March 13th, 2025
- Samsung Electronics Co., Ltd. patent applications on October 17th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on October 17th, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC Patent Application Trends in 2024
- SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD Patent Application Trends in 2024
- SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. Patent Application Trends in 2024
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Patent Application Trends in 2024
T
- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
