Denso corporation (20250069967). SEMICONDUCTOR DEVICE
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Akinori Sakakibara of Toyota-city (JP)
Takanori Kawashima of Toyota-city (JP)
Shingo Tsuchimochi of Toyota-city (JP)
Shoichiro Omae of Kariya-city (JP)
SEMICONDUCTOR DEVICE
This abstract first appeared for US patent application 20250069967 titled 'SEMICONDUCTOR DEVICE
Original Abstract Submitted
a semiconductor device includes a first insulating circuit board, a semiconductor element on the first insulating circuit board, and an encapsulating body. the first insulating circuit board includes a first insulating substrate, and a first inner conductor layer, and a first outer conductor layer. the first inner conductor layer is electrically connected to a first electrode of the semiconductor element inside of the encapsulating body. the first outer conductor layer is exposed from a surface of the encapsulating body. the first inner conductor layer has a first thin-wall portion a thickness of which reduces toward an outer side, along an outer peripheral edge of the first inner conductor layer with a first width. the first outer conductor layer (i) does not have or (ii) has a second thin-wall portion along the outer peripheral edge of the first outer conductor layer with a second width.