18394750. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 18394750 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
A semiconductor package includes a substrate including a first surface and a second surface facing each other, a semiconductor chip on the substrate, a passive element disposed spaced apart from the semiconductor chip in a first direction parallel to the first surface of the substrate, and a first insulating pattern on an edge region of the first surface. The substrate includes a recessed portion formed on the first surface, the passive element vertically overlaps the recess portion, and the first insulating pattern protrudes in a second direction perpendicular to the first surface of the substrate.