SEMICONDUCTOR PACKAGE

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Inventor(s)

SEMICONDUCTOR PACKAGE

This abstract first appeared for US patent application 18804501 titled 'SEMICONDUCTOR PACKAGE

Original Abstract Submitted

A semiconductor package includes a package substrate that extends in a first direction, an interposer on an upper surface of the package substrate, where the interposer includes: a first substrate that includes a first portion having a first thickness in a second direction that is perpendicular to the first direction and a second portion having a second thickness in the second direction that is greater than the first thickness, and a plurality of first through vias that extend into the first substrate, a photonic IC chip on the first portion of the first substrate, where the photonic IC chip includes: a second substrate, a front insulation layer, an optical waveguide, an optical fiber, and a coupler, and a plurality of semiconductor chips on the second portion of the interposer.