SEMICONDUCTOR MODULE

Abstract: a semiconductor module includes a module substrate, a controller device and a memory device mounted on a surface of the module substrate, and a plurality of tabs at a side of the module substrate. the module substrate has a first through hole that vertically extends through the module substrate. the first through hole is between the controller device and the memory device. the first through hole extends in a first direction that runs across between the controller device and the memory device. a length along the first direction of the first through hole is less than a width along the first direction of the controller device.

Inventor(s): Hwanjoo Park, Byunghan Ko, Wook Moon, Heechul Lee

CPC Classification: H01L23/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application))

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