SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Organization Name

Inventor(s)

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

This abstract first appeared for US patent application 20250014953 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Original Abstract Submitted

provided is a semiconductor package including a rewiring structure including a rewiring pattern, and at least one insulating layer, a semiconductor device provided on the rewiring structure, and electrically connected to the rewiring pattern, and a side surface protector covering a first side surface of the semiconductor device, wherein an upper surface of the semiconductor device that is opposite to a lower surface of the semiconductor device facing the rewiring structure and an upper surface of the side surface protector are at the same vertical level and are coplanar with each other, and the side surface protector extends from the insulating layer of the rewiring structure.