Micron technology, inc. (20240194547). SUBSTRATES FOR SEMICONDUCTOR PACKAGES simplified abstract
SUBSTRATES FOR SEMICONDUCTOR PACKAGES
Organization Name
Inventor(s)
Kelvin Aik Boo Tan of Singapore (SG)
See Hiong Leow of Singapore (SG)
SUBSTRATES FOR SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240194547 titled 'SUBSTRATES FOR SEMICONDUCTOR PACKAGES
Abstract: The patent application describes systems with packaged electronic devices, where one or more of the devices have a package substrate with two sections, one elevated with respect to the other to support dies. The first section has layers of material between its top and bottom surfaces, while the second section includes additional layers of material extending horizontally from the first section.
- Simplified Explanation:
- Systems with packaged electronic devices have package substrates with two sections, one elevated, to support dies. - The first section has layers of material between its top and bottom surfaces. - The second section includes additional layers of material extending horizontally from the first section.
- Key Features and Innovation:
- Package substrate with two sections, one elevated. - Layers of material between top and bottom surfaces of the first section. - Additional layers of material in the second section.
- Potential Applications:
- Consumer electronics - Automotive systems - Industrial machinery
- Problems Solved:
- Improved support for dies in packaged electronic devices - Enhanced structural integrity
- Benefits:
- Increased reliability - Better performance - Cost-effective manufacturing
- Commercial Applications:
- Potential use in smartphones, tablets, and other consumer electronics - Integration into automotive control systems - Adoption in industrial automation equipment
- Prior Art:
- Prior research on package substrates in electronic devices - Studies on die support mechanisms
- Frequently Updated Research:
- Ongoing developments in package substrate technology - Research on material properties for electronic device packaging
Questions about the technology: 1. How does the elevation of the second section improve die support in packaged electronic devices? 2. What are the potential cost savings associated with this innovative package substrate design?
Original Abstract Submitted
a variety of applications can include systems having packaged electronic devices. one or more of the packaged electronic devices can include a package substrate, having a first section and a second section with the second section elevated with respect to the first section, to support dies in the two sections. the first section can have a first top surface and a bottom surface with one or more layers of material between the first top surface and the bottom surface. the second section can include a second top surface and the bottom surface of the first section with the one or more layers of material of the first section extending horizontally from the first section. the second section can have one or more additional layers of material between the second top surface and the one or more layers of material of the first section extending horizontally from the first section.