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Category:CPC H01L21/6836
Pages in category "CPC H01L21/6836"
The following 75 pages are in this category, out of 75 total.
1
- 18147515. METHOD AND APPARATUS FOR A SILICON DIE PREPARATION INCLUDING AUXETIC AND ELECTROSTATIC DISSIPATATIVE FEATURES simplified abstract (Intel Corporation)
- 18152340. Method and Treatment System for Uniform Processing of Semiconductor Devices simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18371774. METHOD OF SPLITTING SEMICONDUCTOR CHIP USING MECHANICAL MACHINING AND SEMICONDUCTOR CHIP SPLIT BY THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18390795. CROSSLINKING A BACK GRINDING TAPE FOR A SEMICONDUCTOR WAFER simplified abstract (MICRON TECHNOLOGY, INC.)
- 18464779. BACK GRINDING TAPE HAVING TABS TO ASSIST IN REMOVING THE BACK GRINDING TAPE FROM A WAFER (Western Digital Technologies, Inc.)
- 18508239. SEMICONDUCTOR SUBSTRATE WITH A SACRIFICIAL ANNULUS simplified abstract (MICRON TECHNOLOGY, INC.)
- 18676639. PROCESSING TAPE AND METHOD OF FABRICATING A SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
2
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- IMEC VZW Patent Application Trends in 2024
- Industrial Technology Research Institute Patent Application Trends in 2024
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE Patent Application Trends in 2024
- Intel corporation (20240222182). METHOD AND APPARATUS FOR A SILICON DIE PREPARATION INCLUDING AUXETIC AND ELECTROSTATIC DISSIPATATIVE FEATURES simplified abstract
- Intel Corporation patent applications on July 4th, 2024
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- Micron technology, inc. (20240222183). CROSSLINKING A BACK GRINDING TAPE FOR A SEMICONDUCTOR WAFER simplified abstract
- Micron technology, inc. (20240222184). SEMICONDUCTOR SUBSTRATE WITH A SACRIFICIAL ANNULUS simplified abstract
- Micron Technology, Inc. Patent Application Trends in 2024
- MICRON TECHNOLOGY, INC. Patent Application Trends in 2025
- MICRON TECHNOLOGY, INC. patent applications on July 4th, 2024
- Mitsubishi Electric Corporation Patent Application Trends in 2024
- MITSUBISHI ELECTRIC CORPORATION Patent Application Trends in 2024
- Mitsubishi Electric Corporation patent applications on January 30th, 2025
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- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240312823). METHOD OF SPLITTING SEMICONDUCTOR CHIP USING MECHANICAL MACHINING AND SEMICONDUCTOR CHIP SPLIT BY THE SAME simplified abstract
- Samsung electronics co., ltd. (20240312826). PROCESSING TAPE AND METHOD OF FABRICATING A SEMICONDUCTOR DEVICE USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20250062152). DICING FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY USING THE SAME
- Samsung electronics co., ltd. (20250079225). DICING TAPE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on February 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 20th, 2025
- Samsung Electronics Co., Ltd. patent applications on March 6th, 2025
- Samsung Electronics Co., Ltd. patent applications on September 19th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on September 19th, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC Patent Application Trends in 2024
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- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240234192). Method and Treatment System for Uniform Processing of Semiconductor Devices simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250062153). SYSTEM AND METHOD FOR RING FRAME CLEANING AND INSPECTION
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 20th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on July 11th, 2024
- TDK Corporation Patent Application Trends in 2024
- TOKYO ELECTRON LIMITED Patent Application Trends in 2024
- Tokyo Electron Limited Patent Application Trends in 2024